HEAT REMOVAL IN INTEGRATED CIRCUITS Sandia National Laboratories has a program in developing and using microfluidic systems for chemical analysis and for mechanical actuation. We believe that these capabilities could contribute significantly to DARPA's BAA 98-23, 'Heat removal by thermo-integrated circuits (HERETIC)'. As a Federally Funded Research and Development Center (FFRDC), we would like to offer these capabilities to any and all potential partners in responding to that BAA. Specific capabilities include novel methods for pumping and valving of fluids over a greater range of fluid properties and with greater control than current approaches; and research and diagnostic techniques that include direct, real-time imaging of microscale liquid flows to optimize fluidic design and flow parameters. Interested parties should contact Dr. Phillip H. Paul, MS 9051, Sandia National Laboratories, P.O. Box 969, Livermore, CA 94551-0969 (FAX: 925-294-2595; e-mail: phpaul@ca.sandia.gov). Deadline for response to the BAA is November 19, 1998. In order to respond to the BAA in a timely and coordinated manner, we would like to have interested parties contact Sandia by November 11, 1998. Please note that as an FFRDC we are not able to enter into any exclusive collaborations in response to this BAA, but instead must offer the same capabilities to any potential partner interested in teaming. E-MAIL: Dr. Phillip H. Paul, phpaul@ca.sandia.gov. Posted 11/05/98 (W-SN268938).

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