Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF FEBRUARY 17,1998 PSA#2033

Commanding Officer, USCG Civil Engineering Unit Oakland, 2000 Embarcadero, Suite 200, Oakland, CA 94606-5337

Z -- INSTALLATION OF NEW GROUNDING SYSTEM AT LORAN STATION SEARCHLIGHT, SEARCHLIGHT, NV SOL DTCG88-98-B-623473 DUE 040498 POC Marilyn Van de Loo, Contracting Specialist and Bid Clerk (510) 535-7242 DTCG88-98-B-623473 INSTALLATION OF NEW GROUNDING SYSTEM AT LORAN STATION SEARCHLIGHT, SEARCHLIGHT, NV: Furnish all labor, materials, supervision, transportation, equipment, and all other necessary items required to accomplish installation of additional grounding systems at LORAN Station Searchlight to maintain 5 ohms or less ground resistance. The work includes, but is not limited to, upgrade to the grounding system of the building's main service; upgrade Operation Room ground system; upgrade the transmitter/receiver antenna ground radials. Estimated range is $25,000 to $100,000. The performance period is 120 calendar days after receipt of Notice to Proceed. This procurement is subject to the Small Business Competitiveness Demonstration Program and is open to large and small business participation. The applicable SIC is 1731. Small Business size standard is $7.0 million. THIS IS AN UNRESTRICTED ACQUISITION BEING SOLICITED. ALL RESPONSIBLE SOURCES ARE ENCOURAGED TO RESPOND. For minority, women and disadvantaged business enterprises: The Department of Transportation (DOT Office of Small and Disadvantage Business Utilization has programs to assist minority, women owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. Loans are available under the DOT Short Term Lending Program (STLP) at prime interest rates up to $500,000 per contract to provide accounts receivable financing. The Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $500,000 per contract. DOT provides an 80 percent guaranty on the bond amount to a surety against losses. For further information and applicable forms concerning the STLP and Bonding Assistance Program, please call (800) 532-1169. Anticipated bid issue date is 05 MARCH 1998 with opening date 30 days later. ONLY WRITTEN REQUEST FOR SOLICIATIONS WILL BE ACCEPTED. PLEASE FAX YOUR REQUESTS TO THE ATTENTION OF: Bid Issue Clerk, FAX (510) 535-7288. (0043)

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