Loren Data Corp.

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COMMERCE BUSINESS DAILY ISSUE OF AUGUST 23,1996 PSA#1665

Contracting Officer, USCG CEU, 1240 E. Ninth St., Rm. 2179, Attn: Faye Arnold, Cleveland, OH 44199-2060

Z -- REROOF ADMINISTRATION BUILDING AT USCG BASE DETROIT, MI Sol DTCG83-97-B-3WF017 POC Faye Arnold, 216-522-3955/Ext. 276 Provide all labor, material, equipment, transportation and supervision required to remove roof system and install approximately 19,600 SF of roof membrane on 5 levels of Administration Building with a 60 mil fully adhered EPDM single ply roof system. All compatible flashing and accessories are to be included. Location of work is in Detroit MI and the estimated $100,000.00 and $250,000.00. The SIC Code assigned is 1761. Due Date for Bids will be approximately 10 Oct 1996. Note: This was previously advertised as Solicitation DTCG83-96-B-3WF209 and cancelled after Bid Opening due to a discrepancy in the Specifications. Contractors who requested the bid package for DTCG83-96-B-3WF209 will remain on the bidders list and need not reapply. This office has a Procurement Information Line which may be called for information on current bid openings and solicitation amendments. The number is (216) 522-3955, Ext. 745.) This project is unrestricted in accordance with the Small Business Competitiveness Demonstration Program and is not a set-aside. Any responsible source may submit a bid. The following information is for minority, woman-owned and disadvantaged enterprises: The Dept. of Transportation (DOT), Office of Small and Disadvantaged Business Utilization (OSDBU), has programs to assist minority, woman-owned and disadvantaged business enterprises to acquire short-term working capital and bonding assistance for transportation-related contracts. This is applicable to any eligible prime or subcontract at any tier. The DOT Bonding Assistance Program enables firms to apply for bid, performance and payment bonds up to $1.0 million per contract. The DOT provides an 80% guaranty on the bond amount to a surety against losses. Loans are also available under the DOT Short Term Lending Program (STLP) at prime interest rates to provide accounts receivable financing. The maximum line of credit is $5000,000. For further information and applicable forms concerning the Bonding Assistance Program and/or the STLP, please call the OSDBU at (800) 532-1169. (234)

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