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FBO DAILY - FEDBIZOPPS ISSUE OF JANUARY 20, 2017 FBO #5537
SOLICITATION NOTICE

93 -- 4H SiC HPSI Wafer - NNX1761284Q

Notice Date

1/18/2017
 

Notice Type

Combined Synopsis/Solicitation
 

NAICS

334413 — Semiconductor and Related Device Manufacturing
 

Contracting Office

NASA Shared Services Center (NSSC), Building 1111, Jerry Hlass Road, Stennis Space Center, Mississippi, 39529, United States
 

ZIP Code

39529
 

Solicitation Number

NNX1761284Q
 

Archive Date

2/9/2017
 

Point of Contact

Jonah L. Berry, Phone: 2288136120
 

E-Mail Address

jonah.l.berry@nasa.gov
(jonah.l.berry@nasa.gov)
 

Small Business Set-Aside

Total Small Business
 

Description

This is the capability statement for Cree Inc. Specification for 4H-SiC (Quote Number 19303) The SiC wafers shall have the following specifications: 1. Three 4H-SiC, high-purity semi-insulating, research grade, 3" dia., 8° off-axis, > 1E5 ohm-cm, both sides polished/silicon face with CMP finish. One n-type, > 1 x 1019 cm-3 epilayer of 3.0 μm thick. 2. Three 4H-SiC, high-purity semi-insulating, research grade, 3" dia., 8° off-axis, > 1E5 ohm-cm, both sides polished/silicon face with CMP finish. One n-type, > 1 x 1019 cm-3 epilayer of 5.0 μm thick. 3. Three 4H-SiC, high-purity semi-insulating, research grade, 3" dia., 8° off-axis, > 1E5 ohm-cm, both sides polished/silicon face with CMP finish. One p-type, > 1 x 1020 cm-3 epilayer of 5.0 μm thick. 4. SIMS analysis of epilayers. 5. Delivery to be no later than 8 weeks from date of receipt of PO.
 

Web Link

FBO.gov Permalink
(https://www.fbo.gov/notices/1f3d2b54debdc5de29d3d79aadce2b9f)
 

Place of Performance

Address: NASA / Glenn Research Center, Cleveland, Ohio, 44135-3127, United States

Zip Code: 44135-3127
 

Record

SN04374234-W 20170120/170118234539-1f3d2b54debdc5de29d3d79aadce2b9f (fbodaily.com)
 

Source

FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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