MODIFICATION
58 -- FLIP-CHIP DIE ATTACH SYSTEM W/5MICRON PLACEMENT ACCURACY
- Notice Date
- 12/10/2013
- Notice Type
- Modification/Amendment
- NAICS
- 334310
— Audio and Video Equipment Manufacturing
- Contracting Office
- 53560 Hull Street Bldg A33 Rm 1602W, San Diego CA 92152-5001
- ZIP Code
- 92152-5001
- Solicitation Number
- N66001-14-T-7009
- Response Due
- 12/17/2013
- Archive Date
- 1/16/2014
- Point of Contact
- Point of Contact - NIDA B RAMOS, Contract Specialist, 619-553-4380; BELINDA SANTOS, Contracting Officer, 619-553-4502
- E-Mail Address
-
Contract Specialist
(nida.ramos@navy.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- 12/10/13 / The purpose of this amendment 0001 is to change the title (description) of this Solicitation. ___________________________________________________________________________ This is a SSC Pacific combined synopsis/solicitation for commercial items prepared in accordance with Federal Acquisition Regulation (FAR) Part 12, Acquisition of Commercial Items and FAR Part 13, Simplified Acquisition Procedures. This announcement constitutes the only solicitation. Competitive quotes for brand name or equal are being requested under N66001-14-T-7009 This requirement is set-aside for small businesses, NAICS code is 334119 and business size standard is 500 employees. Item 0001 DIE ATTACH PLACEMENT SYSTEM WITH VIDEO SYSTEM. 5 MICRON PLACEMENT ACCURACY. (QTY-1) INCLUDES: SHIPPING, INSTALLATION AND TRAINING AT CUSTOMER SITE. A HEATED STAGE WITH MECHANICAL CLAMPING TO FIRMLY HOLD THE SUBSTRATE IN PLACE IS REQUIRED. A HOLDER THAT CAN PRESENT WAFFLE OR GEL-PACKS IS NEEDED FOR DIE PICK- UP. A DIE BONDING COLLET WITH VACUUM IS REQUIRED TO PICK UP DIE AND SECURELY HOLD IT DURING THE BONDING PROCESS. THE COLLET FOR A 1.1X1.1MM DIE MAY OR MAY NOT BE INCLUDED IN THE PRICE OF THE SYSTEM. A METHOD TO FLIP DIE FROM PACKS TO THE CORRECT FACE-DOWN ORIENTATION IS DESIRED AS AN OPTION A VISION SYSTEM THAT SHOWS THE SUBSTRATE PADS AND DIE BUMP ALIGNMENT IS REQUIRED, ALONG WITH A MEANS TO MAKE FINE ADJUSTMENTS IN X,Y, AND THETA TO ACHIEVE CORRECT ALIGNMENT TO 5 MICRONS ACCURACY. A PROCESS CAPTURE/MANAGEMENT COMPUTER SYSTEM FOR PROCESS DEVELOPMENT AND STATISTICAL PROCESS CONTROL. Item 0002 MODULES FOR THERMO-SONIC BONDING: (Quantity-1) TO INCLUDE: FORCE RANGE 0.1 - 20N/RESOLUTION 0.1N. SIDE CAMERA OBSERVATION MODULE WITH LED ILLUMINATION HEATING PLATE 100X100MM, 1200W WITH AIR COOLING AND VACUUM HOLDER AN ULTRASONIC GENERATOR AND TRANSDUCER CAPABLE OF APPLYING ENOUGH ENERGY TO SUFFICIENTLY BOND THE BUMPED DIE TO THE SUBSTRATE PADS. I.E. ULTRASONIC MODULE, 20W GENERATOR, 60KHZ. BONDING SOFTWARE Item 0003 UID LABEL COST (IF ANY). Flip-chip die attach system Overview A versatile, accurate die attach system that is capable of less than or equal to 5um accuracy placement, and die attach using ultrasonic and thermal energy is required. The application targeted is one mainly of Thermosonic bonding of gold-bumped die that are 1x1mm in size, and have a small (4-16) number of bumps per die. The application is one of low-volume, prototyping in a laboratory/research environment. The equipment is also called a "flip-chip bonder", "flip-chip aligner/bonder" or a "flip-chip die attach system". Configurability for hot air re-work of printed circuit boards and components is a desirable feature for versatility of the equipment. Capability to be configured as a dispense module for epoxy die attach, and precise die bonding face up is also a desirable feature. This section covers the basic set of specifications that a flip-chip die attach system must meet: Process: The equipment must be capable of the following process: Thermosonic bonding process for gold-bumped tiny die: The die in this process are gold stud bumped. The dies are commonly silicon, but can be sapphire. They are 1x1 mm in size, but can range up to 5x5mm. The dies are picked from waffle or gel packs, and the bumps are aligned with the bond pads on the substrate. The bond pads are commonly gold-coated copper pads. Substrates commonly in use are FR4, LCP, polyimide, or combinations of materials which need to be accommodated up to at least 4x4 inches, with 6x6 inches being desirable. The substrate is placed on a stage, mechanically clamped and heated. The die is vacuum picked from a waffle or gel-pak container, (die flipping is desirable, but is usually an option and an additional expense) aligned with the substrate pads (usually using split optics) and brought into contact with the substrate and pads. A known pressure is applied and ultrasonic energy is applied with a time/temperature profile until the gold bumps are fused with the pads. A microscope system that can observe the process in-situ is desirable. Underfills (a liquid epoxy material) may be used subsequent to this process to enhance reliability. Minimum Specifications: 1. A heated stage with mechanical clamping to firmly hold the substrate in place is required. 2. A holder that can present waffle or gel-packs is needed for die pick- up. 3. A method to flip die from packs to the correct face-down orientation is desired. 4. A die bonding collet with vacuum is required to pick up die and securely hold it during the bonding process. The collet for a 1.1x1.1mm die may or may not be included in the price of the system. 5. An ultrasonic generator and transducer capable of applying enough energy to sufficiently bond the bumped die to the substrate pads. 6. A vision system that shows the substrate pads and die bump alignment is required, along with a means to make fine adjustments in x,y, and theta to achieve correct alignment to 5 microns accuracy. 7. A process capture/management system for process development and statistical process control. NOTE: QUOTES MUST BE UPLOADED IN THE SPAWAR E-COMMERCE WEBSITE TO BE CONSIDERED. Basis for award: The government anticipates awarding a firm-fixed price purchase order to the lowest bidder, technically acceptable. This solicitation document incorporates provisions and clauses in effect through Federal Acquisition Circular Fac 2005-70, Effective 30 Sep 2013 and Defense Federal Acquisition Regulation Supplement (DFARS), DPN 20131118 (Effective 18 Nov 2013) Edition. It is the responsibility of the contractor to be familiar with the applicable clauses and provisions. The clauses can be accessed in full text at www.farsite.hill.af.mil. Current FAR & DFAR. The provision at 52.212-1, Instructions to Offerors Commercial and 52.212-4, Contract Terms and Conditions Commercial Items, incorporated by reference, applies to this acquisition FAR Clause 52.212-3, Offeror Representations and Certifications -- Commercial Items and DFAR S 252.212-7000 Offeror Representations and Certifications--Commercial Items are in the e-Commerce website at https://e-commerce.sscno.nmci.navy.mil. FAR Clause 52.212-5-Contract Terms and Conditions Required to Implement Statutes or Executive Orders -- Commercial Items applies to acquisition and includes 52.222-50, Combating Trafficking in Persons (22 U.S.C. 7104(g)), 52.233-3, Protest After Award (31 U.S.C. 3553), 52.233-4, 52.222-3, Convict Labor (E.O. 11755), 52.222-19, Child LaborCooperation with Authorities and Remedies (E.O. 13126), 52.222-21, Prohibition of Segregated Facilities (Feb 1999), 52.222-26, Equal Opportunity(E.O. 11246), 52.211-6 Brand Name or Equal, 52.225-13, Restrictions on Certain Foreign Purchases (E.O.'s, proclamations, and statutes administered by the Office of Foreign Assets Control of the Department of the Treasury), 52.232-33, Payment by Electronic Funds TransferCentral Contractor Registration (31 U.S.C. 3332), 52.214-6, Explanation of Prospective Bidders, 52.214-7 Late Submissions, Modifications and Withdrawals of Bids. FAR CLAUSE 52.204-99 System for Award Management Registration (Aug. 2012) (Deviation) DFARS Clause 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Executive Orders Applicable to Defense Acquisition of Commercial Items Deviation apply to this acquisition and includes 52.203-3, Gratuities (10 U.S.C. 2207), 252.225-7001, Buy American Act and Balance of Payments Program (41 U.S.C. 10a-10d, E.O. 10582), 252.232-7003, Electronic Submission of Payment Requests and Receiving Reports (10 U.S.C. 2227) DFARS Clause 252.204-7001,Commercial and Government Entity (CAGE) Code Reporting, 52.204-6, Data Universal Numbering System (DUNS). DFAR 252.211-7003, Unit Identification and Valuation (applies to items over 5k). This RFQ closes on December 17, 2013 at 12:00 PM, Pacific Daylight Time (PDT). Quotes must be uploaded on the SPAWAR e-commerce website at https://e-commerce.sscno.nmci.navy.mil, under SSC Pacific/Simplified Acquisitions/N66001-14-T-7009 Questions or inquiries contact Aurora Vargas at (619) 553-0901 / aurora.vargas@navy.mil Phone or fax will not be considered. The point of contact for this solicitation is Nida B. Ramos nida.ramos@navy.mil Please include RFQ N66001-14-T-7009 on all inquiries. All responding vendors must be registered to the System for Award Management (SAM) Website prior to award of conduct. Information can be found at https://www.sam/gov/.
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