SOLICITATION NOTICE
59 -- MG 1B Board Fabrication and Assembly
- Notice Date
- 6/13/2012
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 334412
— Bare Printed Circuit Board Manufacturing
- Contracting Office
- Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
- ZIP Code
- 95652
- Solicitation Number
- H94003-12-T-1224
- Archive Date
- 7/10/2012
- Point of Contact
- Edward I. Kurjanowicz, Phone: 9162311527, Kurt Verner,
- E-Mail Address
-
edward.kurjanowicz@dmea.osd.mil, kurt.verner@dmea.osd.mil
(edward.kurjanowicz@dmea.osd.mil, kurt.verner@dmea.osd.mil)
- Small Business Set-Aside
- Total Small Business
- Description
- This is a combined synopsis/solicitation for commercial items in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. This purchase is a 100% small business set-aside. This Defense Microelectronics Activity (DMEA) Request for Quote (RFQ) announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. The NAICS code is 334412 and the size standard for this requirement is 500 employees. The RFQ reference number is H94003-12-T-1224. DPAS rating is DO-A7. Offerors Quotes shall be valid for a minimum of 60 days. Offerors Quotes are due to the Defense Microelectronics Activity (DMEA) contracting office by 3:00pm (PST) on June 25, 2012 and will be electronically sent by email to Ed Kurjanowicz at edward.kurjanowicz@dmea.osd.mil. Defense Microelectronics Activity (DMEA) is developing an assembled printed circuit board (PCB) with RF and digital functionality. The purpose of this combined synopsis/solicitation is to acquire commercial manufacturing services for the fabrication and assembly of the PCB design. The purchase order (PO) will have two (2) separately priced (quoted) requirements and deliveries: contract line items (CLINs) 0001 - 1st Article Units (Basic); and 0002 - 1st Production Units (Option 1). Under CLIN 0001 - 1st Article Units (Basic): the contractor shall fabricate and assemble the PCB design provided by the government (DMEA) per the latest revision of the IPC-2222 Class-2 standard for Sectional Design Standard on Rigid Organic Printed Boards and the IPC-1601 standard for Printed Board Handling and Storage Guidelines (see ‘Readme_DMEA.txt' for additional requirements). The contractor shall fabricate 600 bare PCBs (60 panels of 10 boards each) based on the Gerber files provided as GFI (see Appendix A for a notional panel layout). The contractor shall implement an optimal means to separate assembled PCBs from the panels without damaging the assembled PCBs (e.g., tab routing, v-scoring, etc.) The contractor shall visually inspect the 600 fabricated PCBs (60 panels of 10 boards each). The contractor shall ensure that the 600 fabricated PCBs (60 panels of 10 boards each) to be delivered are free from any visual and manufacturing defects. The contractor shall perform opens and shorts testing on the fabricated PCBs. The contractor shall ensure that the 600 fabricated PCBs (60 panels of 10 boards each) to be delivered are free from any opens and shorts. The contractor shall assemble 20 PCB assemblies (PCBAs). The contractor shall visually inspect the 20 PCBAs per the latest revision of the IPC-A-610 Class-3 standard. All PCB assemblies must pass Class-3 level criteria of the latest IPC A-610 revision. The contractor shall resolve any issues/defects discovered by this inspection. The contractor shall ensure that all inspections are performed by a current IPC-A-610 certified inspector. The contractor shall provide the name(s), certificate number(s), and certification expiration date(s) of the person(s) performing all the inspections per the IPC A-610 Class-3 standard. The contractor shall deliver the 20 PCBAs, the residual PCBs in panel form, the IPC-A-610 non acceptable/defect classified PCBAs, and the updated pick and place file to the Contracting Officer's Representative (COR). The 20 PCBAs, the residual PCBs in panel form, the IPC-A-610 non acceptable/defect classified PCBAs, and the updated pick and place file shall be delivered no later than 7 weeks ARO (see DD Form 1423, A001). The government will visually inspect the 20 delivered PCBAs per the latest revision of the IPC-A-610 Class-3 standard. The duration of the government review and inspection will be no more than four (4) weeks. The contractor shall replace any PCBs and PCBAs that do not pass the review and inspection of the government. The contractor shall assemble the replacements in accordance with above. The contractor shall deliver the replacements to DMEA no later than four (4) weeks after date of award for the replacements. The government will review and inspect the replacements. Any parts or material will be provided as Government Furnished Property (GFP) by DMEA. The contractor shall deliver the residual components and panels once the requirement of 20 PCBs is met (see DD 1423 A002). To avoid common failure conditions (e.g., internal PCB delamination, component wire bond damage, component die damage, internal component cracks, etc.), all components susceptible to moisture induced damage must be manufactured, packaged/assembled, and handled per the following relevant standards (as applicable): J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for non-hermetic solid state surface mount devices; J-STD-033 Joint IPC/JEDEC standard for handling, packing, shipping, and use of moisture/reflow sensitive surface mount devices; and IPC-1601 Printed Board Handling and Storage Guidelines. New factory sealed MSD components delivered to the contractor from the government will not undergo a desiccation or baking process prior to the processing of such components. Per all pertinent standards, all excess MSD components returned to the government shall at a minimum be sealed in a moisture barrier pack with a Humidity Indicator Card (HIC) and desiccant, shall include a written indication of the total floor exposure time limit and environment conditions for each device, and shall be delivered in dry packing. All moisture barrier packs shall be at least 11-months from its "Sealed Bag Shelf Life" expiration date, and they must be individually labeled with the Floor Exposure Time Limit, its corresponding Environment Conditions, and the appropriate Moisture Classification (J-STD-020/033) including its applicable MSD Level (1-6). The contractor shall take proper precautions while processing any and all MSD components to avoid reaching the initial floor exposure time limit of each individual device. Under CLIN - 0002 1st Production Units (OPTION 1): the contractor shall assemble 400 additional PCBAs in accordance with CLIN 0001 above. The contractor shall deliver the assembled PCBAs no later than 4 weeks after date of award (see DD Form 1423, A003). Testing criteria and COR acceptance will be based upon a comparison of assembly drawings and COR accepted CLIN 0001 - 1st Article Units (Basic) including an examination of the electrical properties and other required CLIN 0001 testing. Under Government Furnish Property (GFP) to the Offerors at email request in accordance with instructions below, DMEA will provide the Gerber files and any additional data necessary for the contractor to complete the PCB/PCBA fabrication and assembly including but not limited to: Gerber Files (at request for quotation); Bill of Materials (BOM) (at request for quotation); Assembly Drawing (at request for quotation); Readme_DMEA.txt file (at request for quotation); and BOM components, material, etc. (at purchase order award). All quote requirements can be found in this RFQ, the Statement of Work (SOW), appendices and attachments. To request email copies, please contact DMEA contracting office point of contact (POC) Ed Kurjanowicz (916-231-1527) by email at edward.kurjanowicz@dmea.osd.mil. In request, Offerors will include: company name; CAGE code; point of contact name and title; and postal, web and email address. Delivery, acceptance and FOB point for above CLINs 0001 and 0002 deliverables is: Defense Microelectronics Activity (DMEA) at 4234 54th Street, McClellan, CA 95652-2100. Upon DMEA acceptance of the final delivered unit, the contractor shall deliver to DMEA all residual PCB panels (assembled and non-assembled) and parts purchased for this project not consumed by the delivered assemblies. Residual PCBs shall remain in panels. The contractor shall keep track of the amount of components/material consumed and provide quantities for each part number returned to DMEA. The contractor shall conduct technical interchange meetings (TIMs) as necessary or by the request of DMEA COR in the performance of this task. The technical interchange meeting with the contractor shall be scheduled when there is need for technical interchange between the DMEA and the contractor. The content of the meeting can include the discussion of any information that will impact task related activities. In their proposal to this RFQ, Offerors will include and provide: their price and deliverables with period of performance (starting from date of purchase order award) for CLINs 0001 and 0002; total purchase order price; and a description of their technical approach and methodology to meet the requirements of CLIN 0001 and 0002 and this solicitation. Offerors approach will include, but is not limited to: how the panel of boards will be populated and disconnected as separate, assembled PCBs, for example, tab routing, v-scoring, etc.: a description for the panelized PCB assembly that takes into consideration reflow temperature profiles to assure proper solder reflow, electrical reliability, and mechanical reliability between all components on a given board (both SnPb and SAC-305/Pb-free components) and the PCB itself; verify that they have the capability to manufacture the provided Gerber file (this verification shall include a DFM check, and the feedback shall be included in the proposal); a proposed layer stack up to achieve the required thickness and number of signal layers; describe any techniques or processing steps to manufacture the PCB, for example, laser drilling, via fills, etc.; specify the board material and board finish that will be used; list of all personnel working on this task under the contractor and sub-contractor if applicable (note that all personnel working on this task must be ITAR compliant); description of their technical capability; description of their technical expertise and capability on above requirements; describe work of comparable complexity that was done for past projects within the past 3 years related to similar PCB fabrication; reference for the corresponding past projects described herein; and Department of Defense (DoD) contract number, if applicable. Also in their description of their technical expertise and capability, Offerors will provide in PCB fabrication and assembly: the Maximum routing layers in a finished thickness of 21 mils; Minimum finished board thickness with 8 signal layers; Minimum trace widths; Minimum via sizes; Minimum/maximum drill aperture; Blind/buried via capability; Controlled impedance/dielectric (i.e., 50 traces); Tab routing, V-scoring, etc. capabilities and limits; Available board materials and board finish; Electrical testing; and High density layouts for analog, digital, mixed-signal, and RF designs. The contractor shall indicate any aspects of the technical approach that will be subcontracted. The contractor shall list all personnel working on this task under the contractor and sub-contractor if applicable. All personnel working on this task must be ITAR compliant. The contractor shall provide a copy of their ITAR certification. All personnel involved with inspections must be IPC certified. The contractor shall provide the name(s) of their IPC certified inspector(s) and the expiration date of the corresponding certification(s). Offerors technical approach, capability (including, but not limited to company/workers being ITAR certified/compliant), schedule (period of performance), and past performance will first be evaluated for acceptability on a pass or fail basis. Quotes passing these factors will then proceed to a best value source selection process where technical approach, capability, and past performance are significantly more important than price when being evaluated. All quote requirements can be found in this RFQ, the Statement of Work (SOW), appendices and attachments. To request email copies, please contact Defense Microelectronics Activity (DMEA) contracting office point of contact (POC) Ed Kurjanowicz (916-231-1527) by email at edward.kurjanowicz@dmea.osd.mil. This RFQ solicitation and incorporated provisions and clauses are those in effect and current to FAR Federal Acquisition Circular (Fac) 205-58 and DFARS DPN 20120522. The following FAR and DFARS Clauses apply: 52.212-1 Instructions to Offerors-Commercial Items; 52.212-2, Evaluation-Commercial Items; 52.212-3 Offeror Representations and Certifications-Commercial Items; 52.212-4 Contract Terms and Conditions-Commercial Items; 52.212-5 Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items; 52-245-1, Government Property; 52.253-1 Computer Generated Forms; 252.204-7008 Export-Controlled Items; 252.232-7003 Electronic Submission of Payment Requests and Receiving Reports; and other clauses as required in the performance of a government purchase order for commercial items/services. Offerors Quotes are due to the Defense Microelectronics Activity (DMEA) contracting office by 3:00pm (PST) on June 25, 2012 and will be electronically sent by email to Ed Kurjanowicz at edward.kurjanowicz@dmea.osd.mil. All emailed documents will be in 12 point Font and Adobe.pdf format. Questions regarding this solicitation should be emailed to the contracting POC, Ed Kurjanowicz at edward.kurjanowicz@dmea.osd.mil. DMEA greatly appreciates your Quotes.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-12-T-1224/listing.html)
- Place of Performance
- Address: Defense Microelectronics Activity (DMEA)/4234 54th Street, McClellan, California, 95652-2100, United States
- Zip Code: 95652-2100
- Zip Code: 95652-2100
- Record
- SN02774063-W 20120615/120613234908-35458190cf844c833cc2624276082c27 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
| FSG Index | This Issue's Index | Today's FBO Daily Index Page |