MODIFICATION
59 -- State of the Art Trusted Foundry Services
- Notice Date
- 4/2/2012
- Notice Type
- Modification/Amendment
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
- ZIP Code
- 95652
- Solicitation Number
- H94003-12-RFI-001
- Archive Date
- 5/12/2012
- Point of Contact
- Linda A. Baustian, Phone: 9162311658, Kellie M. Valdez, Phone: 916-231-1523
- E-Mail Address
-
linda.baustian@dmea.osd.mil, kellie.valdez@dmea.osd.mil
(linda.baustian@dmea.osd.mil, kellie.valdez@dmea.osd.mil)
- Small Business Set-Aside
- N/A
- Description
- Synopsis: The Defense Microelectronics Activity (DMEA) seeks information for the purpose of obtaining access to leading edge Trusted Foundry (TF) services for meeting US Government (USG) requirements beginning in October 2013. This announcement is not a Request for Proposals (RFP) and does not commit the Government to award a contract now or in the future. No solicitation is available at this time. If a solicitation is released by DMEA, it will be synopsized in the FedBizOpps. It is the responsibility of potential offerors to monitor these sites for the release of any solicitation or synopsis. Further, neither DMEA nor the USG will be responsible for any cost incurred in furnishing this information. Background: The DoD and other USG entities require access to a wide range of microelectronics services. Ensuring the confidentiality and integrity of specialized military devices) has become increasingly challenging owing to the globalization of the integrated circuit (IC) industry. The DoD Trusted Foundry Program was established to ensure mission-critical national defense systems can obtain classified (up to the SECRET level and may include NOFORN and COMSEC) and unclassified Trusted ICs, such as application specific integrated circuits (ASICs), from sources that have the capability to protect the confidentiality and integrity of these devices. The TF program includes accreditation of trusted sources for design, aggregation, mask manufacturing, wafer fabrication, post-processing, packaging/assembly, test, and broker services. A list of the currently accredited suppliers can be found at the DMEA website. (Ref 1) Trusted ICs require the use of trusted services throughout the supply chain. A key requirement includes access to TF capabilities (mask and wafer fabrication) for leading edge and state-of-the-art semiconductor process technologies. The DoD and NSA have requirements that include military temperature ranges and radiation hardness requirements; developing libraries and/or processes to support these needs may be required. TF access will be required by 1 October 2013 when an existing contract for such services (Ref 2) reaches the end of its contractual period of performance. Based on previously observed demand, a minimum of approximately 1200 wafers per year (8-inch equivalent) will be required from a state-of-the-art TF to fulfill USG ASIC needs. Additional quantities of wafers might also be required to supply the DoD with other types of Trusted devices (e.g., processors, FPGAs, etc.) as required by policy and effective program protection. Trusted suppliers must possess and maintain a SECRET facility security clearance (Ref 3), an ISO-9001 quality system certification for any manufacturing or assembly work, and otherwise protect all trusted designs and devices with a cleared chain-of-custody (a cadre of individuals who possess personnel security clearances) including, as applicable, computer systems accredited by Defense Security Service (DSS) for processing classified information (Ref 4). DMEA works closely with trusted supplier applicants to implement security protocols for trusted services without requiring changes to ordinary commercial services. Accreditation by DMEA as a trusted supplier is required prior to performing work as a trusted foundry. Qualified companies are encouraged to contact DMEA to obtain a complete set of requirements. Draft Acquisition Approach: • 5-year contract (maximum term currently allowed) • Alternative business models such as Prime, Prime with Subcontractors, and Teaming will be considered • Foundry as Prime Contractor approach • Aggregator as Prime Contractor approach • Possible multi-award award indefinite delivery / indefinite quantity (ID/IQ) Approach A: Foundry as Prime Contractor - This approach awards a contract to a TF or foundries to satisfy the requirements. Awardees would have to show how internal capabilities or a third party arrangement (e.g., with an aggregator) would be used. Approach B: Aggregator as Prime Contractor - This approach awards a contract to an aggregator(s) and allows them to partner with leading edge foundry(s) to satisfy the requirements. Customers (from the DoD, USG, and from their defense contractors) would access these leading edge TF services via a Trusted Aggregator, which may or may not be a third party. Awardees would have to show how internal capabilities and third party partnering (e.g., with one or more foundries) would be used. Minimum Requirements (all must meet Trust and ITAR requirements) 1) Access to leading edge and state-of-the-art CMOS (≤65nm) technologies 2) Provisions to provide timely access to leading edge and state-of-the-art SiGe BiCMOS technologies as technologies advance.. 3) Trusted aggregation services for a Multi-Project Wafer (MPW) program for R&D and prototype development for both Trusted and Untrusted requirements 4) Dedicated prototype runs 5) Production runs 6) Ability to produce or otherwise obtain Trusted masks as needed for these purposes 7) Design kits and libraries for use by the USG and its contractors 8) Access to complete ASIC services (including design, fabrication, packaging, test) 9) Test, failure analysis, design, and technology support services for users of fabrication technologies Desired Objectives (Goals) 1) Trusted access to other leading edge and state-of-the-art microelectronics technologies to be identified by respondent/offeror 2) Approaches to retarget untrusted FPGA devices and designs to trusted supply chains (DoD accredited suppliers) via prime, partner, or subcontractor. 3) Extension of trust access to other categories of components (e.g., microprocessors, graphics processors, digital signal processors, analog to digital converters, photonics, MEMS, etc.). 4) Ability to provide and to license intellectual property (IP) a. Design IP (including third party IP) and flexibilities in licensing/use arrangements. b. Process and tools IP for use by the DoD/DMEA for USG purposes (e.g., to sustain weapon systems when processes are no longer available to the DoD from trusted sources). 5) Access to research pertaining to performance of contract goals. Specific information being sought from industry for each of the minimum requirements and desired objectives listed above: 1) Ability to meet each of the minimum requirements and desired objectives. Be specific and identify issues a) Identify the technologies to be made available i) Provide a technology roadmap with timeline for availability (NSA and DoD have requirements spanning legacy to leading edge semiconductor technologies). ii) Describe how these new technologies could be made available to users once the technologies come online without contract modification while maintaining compliance with acquisition laws/regulations b) Discuss familiarity and feasibility of entering contracts with the USG or DoD. c) Discuss potential contract and pricing arrangements, including a multiple award indefinite delivery / indefinite quantity (ID/IQ) contract. 2) Feasibility of forming partnerships/teams to address the entire scope of requirements and objectives. 3) Discuss any alternate acquisition approaches to be considered that would be of interest to potential foundry/mask/aggregator/FPGA teams, including any alternate customer-centric engagement model versus the current Government-centric model. The anticipated NAICS code is: 334413. Responses to this RFI are limited to 50 pages. All information received in response to this RFI marked "Proprietary" or "Confidential" will be handled accordingly. Responses to the RFI will not be returned nor will respondents be notified of the results of this RFI posting. Electronic responses to this RFI posting shall be in Adobe PDF or Microsoft Word format and must be submitted no later than 4:00PM Pacific Daylight-Savings Time, on 27 April, 2012. All electronic responses must be sent to Linda.baustian@dmea.osd.mil with "SOTA TFS RFI Response" in the subject line. Based on the level of interest in this requirement, an Industry Day is anticipated and will be scheduled 7-21 days after receipt of RFI responses. Firms responding to the RFI posting will be advised of the specific Industry Day date. References: 1. http://www.dmea.osd.mil/trustedic.html 2. http://www.nsa.gov/business/programs/tapo.shtml 3. Details at http://www.dss.mil/isp/fac_clear/fac_clear.html 4. Details at http://www.dss.mil/isp/odaa/odaa.html
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-12-RFI-001/listing.html)
- Place of Performance
- Address: To be determined, To be determined, United States
- Record
- SN02711188-W 20120404/120402234531-e4da2b6051df3b986d68c12d2d5ad443 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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