AWARD | 59 | Multi-chip Die Bonder with Integrated Dispenser Install, Training, and Maintenance

FBO DAILY ISSUE OF AUGUST 19, 2010 FBO #3190
AWARD

59 -- Multi-chip Die Bonder with Integrated Dispenser Install, Training, and Maintenance

Notice Date: 8/17/2010
Notice Type: Award Notice
NAICS: 334413 — Semiconductor and Related Device Manufacturing
Contracting Office: Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
ZIP Code: 95652
Solicitation Number: H94003-10-R-5611
Archive Date: 8/28/2010
Point of Contact: Colten J, Murray, Phone: 9162311517, Linda Baustian, Phone: 9162311658
E-Mail Address: murray@dmea.osd.mil, baustian@dmea.osd.mil
(murray@dmea.osd.mil, baustian@dmea.osd.mil)
Small Business Set-Aside: N/A
Award Number: H94003-10-C-1016
Award Date: 8/13/2010
Awardee: Besi North America
Award Amount: $324,148.24
Web Link: FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-10-R-5611/listing.html)
Place of Performance: Address: 4234 54th Street, McClellan, California, 95652, United States; Zip Code: 95652
Record: SN02244028-W 20100819/100818000026-8c94afc75db40db4d6eadb56b490754b (fbodaily.com)
Source: FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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