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FBO DAILY ISSUE OF JUNE 25, 2010 FBO #3135
MODIFICATION

70 -- RECOVERY--70--RECOVERY - HP BLADE SERVERS

Notice Date
6/23/2010
 
Notice Type
Modification/Amendment
 
Contracting Office
1701 N Fort Meyer Drive, Rosslyn, VA 22209
 
ZIP Code
22209
 
Solicitation Number
101903C008_02
 
Response Due
6/22/2010
 
Archive Date
12/19/2010
 
Point of Contact
Name: Felicia Goudy, Title: Contract Specialist, Phone: 7038755202, Fax:
 
E-Mail Address
goudyfd@state.gov;
 
Small Business Set-Aside
N/A
 
Description
CANCELLATION NOTICE: Bids are being solicited under solicitation number 101903C008_02. This announcement constitutes the only solicitation; bids are being requested and a written solicitation will not be issued. The solicitation is issued as an invitation for bids (IFB), unless otherwise indicated herein. If your company can provide the product/services listed on the solicitation and comply with all of the solicitation instructions, please respond to this notice. To view the specifications, please go to www.FedBid.com and reference Buy No. 191667_01. NASA SEWP IV Bids Only: Sellers bidding on this opportunity MUST have the items requested on an existing NASA SEWP IV contract. The Schedule must either be in the Seller's name or the Seller must be able to document its ability to act as an agent of a partner's Schedule. Sellers must not bid more than their applicable contract ceiling price, excluding the FedBid Fee, for contract-specific items. If FedBid receives notice that, due to inclusion of the FedBid Fee, the Selected Bid's line item pricing is higher than the Selected Seller's applicable published government contract pricing, the FedBid Fee will be reduced to ensure the Selected Bid's line item pricing does not exceed the Selected Seller's applicable contract pricing. Sellers may offer Open Market items only in accordance with the approved Terms and Conditions of their respective NASA SEWP IV contract AND upon approval from the soliciting Contracting officer. Information regarding NASA SEWP IV contracts is available at http://www.sewp.nasa.gov. The FedBid system will automatically calculate SEWP fees to the Seller bid. This is viewable on the Seller's bid confirmation page prior to submittal. This requirement is unrestricted and only qualified sellers may submit bids. The solicitation pricing on www.FedBid.com will start on the date this solicitation is posted and will end on 2010-06-22 11:00:00.0 Eastern Time or as otherwise displayed at www.FedBid.com. FOB Destination shall be WASHINGTON, DC 20520 The Department of State requires the following items, Exact Match Only, to the following: LI 001, HP 10642G2 200MM EXTN SHOCK RACK. AF034A, 1, EA; LI 002, HP FACTORY EXPRESS BASE RACKING`AF034A 0D1, 1, EA; LI 003, HP BLC7000 CTO 3 IN LCD ROHS ENCL 57019-621, 1, EA; LI 004, FACTORY INTEGRATION (MANUFACTURER) 507019-621 001, 1, EA; LI 005, HP VCEM BL-C7000 NM 1-ENCL LIC. 459864-B21, 1, EA; LI 006, FACTORY INTEGRATION (MANUFACTURER). 459864-621 0D1, 1, EA; LI 007, HP BL490C G6 CTO BLADE. 498357-B21, 11, EA; LI 008, FACTORY INTEGRATION (MANUFACTURER)498357-B21 0D1, 11, EA; LI 009, HP X5670 BL490C G6 FIO KIT. 595826-L21, 11, EA; LI 010, HP X5670 BL490C G6 KIT 595826-821, 11, EA; LI 011, FACTORY INTEGRATION (MANUFACTURER) 595826-821 0D1, 11, EA; LI 012, HP 4GB 2RX4 PC3-10600R-9. 500658-B21, 198, EA; LI 013, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 0D1, 198, EA; LI 014, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871-821, 11, EA; LI 015, FACTORY INTEGRATION (MANUFACTURER). 451871 -B21 0D1, 11, EA; LI 016, HP BL490C G6 CTO BLADE. 498357-B21, 5, EA; LI 017, FACTORY INTEGRATION (MANUFACTURER) 498357-821 0D1, 5, EA; LI 018, HP X5670 BL490C G6 FIO KIT. 595826-L21, 5, EA; LI 019, HP X5670 BL490C G6 KIT. 595826-B21, 5, EA; LI 020, FACTORY INTEGRATION (MANUFACTURER). 595826-821 0D1, 5, EA; LI 021, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 90, EA; LI 022, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 01, 90, EA; LI 023, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871 -B21, 5, EA; LI 024, FACTORY INTEGRATION (MANUFACTURER)451871 -821 0D1, 5, EA; LI 025, HP 80GB IO ACCELERATOR FOR BLADESYSTEM. AJ876A, 5, EA; LI 026, FACTORY INTEGRATION (MANUFACTURER). AJ876A 0D1, 5, EA; LI 027, ADP SUPPORT EQUIPMENT - HP BLC VC FLEX-10 ETHERNETMODULE. 1455880-B21, 2, EA; LI 028, FACTORY INTEGRATION (MANUFACTURER). 1455880-B21 0D1, 2, EA; LI 029, HP BLC VC-FC 8GB 24-PORT OPT KIT. 466482-B21, 2, EA; LI 030, FACTORY INTEGRATION (MANUFACTURER). 466482-B21 0D1, 2, EA; LI 031, HP 10GB SR SFP+ FOR BLADESYSTEM. 455883-B21, 16, EA; LI 032, FACTORY INTEGRATION (MANUFACTURER). 455883-B21 01, 16, EA; LI 033, HP 2400W HIGH EFFICIENCY POWER SUPPLY. 499243-B21, 6, EA; LI 034, FACTORY INTEGRATION (MANUFACTURER)499243-B21 0D1, 6, EA; LI 035, HP BLC7000 ENCL SINGLE FAN OPTION. 412140-B21, 6, EA; LI 036, FACTORY INTEGRATION (MANUFACTURER). 1412140-821 0D1, 6, EA; LI 037, HP BLC7000 DDR2 ENCL MGMT OPTION. 456204-B21, 1, EA; LI 038, FACTORY INTEGRATION (MANUFACTURER). 456204-B21 0D1, 1, EA; LI 039, HP BLC7000 1PH FIO POWER MODULE OPT. 413379-B21, 1, EA; LI 040, HP 3Y 4HR 24X7 HW SUPPORT. HA104A3, 1, EA; LI 041, HP C7000 ENCLOSURE HW SUPP. HAI04A37FX, 1, EA; LI 042, HP C7000 ENCLOSURE HW SUPPORT. HAl04A3 7XE, 16, EA; LI 043, HP INSTALLATION AND STARTUP SERVICE. HA114Al, 1, EA; LI 044, HP STARTUP BLADESYS C-CLASS INFRASTR SVC. HA114A15FY, 1, EA; LI 045, HP BLC7000 10K RACK SHIP BRKT OPT KIT. 433718-B21, 1, EA; LI 046, FACTORY INTEGRATION (MANUFACTURER). 433718-B21 0D1, 1, EA; LI 047, ADP SUPPORT EQUIPMENT - HP BLC7000 CTO 3 IN LCDROHS ENCL. 507019-821, 1, EA; LI 048, FACTORY INTEGRATION (MANUFACTURER). 507019-B21 0D1, 1, EA; LI 049, HP VCEM BL-C7000 NM 1-ENCL LIC. 459864-B21, 1, EA; LI 050, FACTORY INTEGRATION (MANUFACTURER). 459864-B21 0D1., 1, EA; LI 051, HP BL490C G6 CTO BLADE. 498357-B21, 11, EA; LI 052, FACTORY INTEGRATION (MANUFACTURER). 1498357-B21 0D1, 1, EA; LI 053, HP X5670 BL490C G6 FIO KIT. 595826-L21, 11, EA; LI 054, HP X5670 BL490C G6 KIT. 595826-B21, 11, EA; LI 055, FACTORY INTEGRATION (MANUFACTURER). 595826-B21 0D1, 11, EA; LI 056, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 198, EA; LI 057, FACTORY INTEGRATION (MANUFACTURER)500658-B21 0D1, 198, EA; LI 058, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871 -B21, 11, EA; LI 059, FACTORY INTEGRATION (MANUFACTURER)451871 -B21 0D1, 11, EA; LI 060, HP BL490C G6 CTO BLADE. 498357-B21, 5, EA; LI 061, FACTORY INTEGRATION (MANUFACTURER). 498357-B21 0D1, 5, EA; LI 062, HP X5670 BL490C G6 FIO KIT. 595826-L21, 5, EA; LI 063, HP X5670 BL490C G6 KIT. 595826-B21, 5, EA; LI 064, FACTORY INTEGRATION (MANUFACTURER). 595826-B21 0D1, 5, EA; LI 065, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658.B21, 90, EA; LI 066, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 OD1, 90, EA; LI 067, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871.B21, 5, EA; LI 068, FACTORY INTEGRATION (MANUFACTURER). 451871-B21 0D1, 5, EA; LI 069, HP 80GB IO ACCELERATOR FOR BLADESYSTEM. AJ876A, 5, EA; LI 070, FACTORY INTEGRATION (MANUFACTURER), 5, EA; LI 071, HP BLC VC FLEX-10 ETHERNET MODULE 45588O-B21, 2, EA; LI 072, FACTORY INTEGRATION (MANUFACTURER), 2, EA; LI 073, HP BLC VC-FC 8GB 24-PORT OPT KIT. 466482-B21, 2, EA; LI 074, FACTORY INTEGRATION (MANUFACTURER), 2, EA; LI 075, HP 10GB SR SFP+ FOR BLADESYSTEM. 1455883-B21, 16, EA; LI 076, FACTORY INTEGRATION (MANUFACTURER). 455883-B21 0D1, 16, EA; LI 077, HP 2400W HIGH EFFICIENCY POWER SUPPLY. 499243-B21, 6, EA; LI 078, FACTORY INTEGRATION (MANUFACTURER). 499243-821 0D1, 6, EA; LI 079, HP BLC7000 ENCL SINGLE FAN OPTION. 412140-B21, 6, EA; LI 080, FACTORY INTEGRATION (MANUFACTURER). 412140-B21 0D1, 6, EA; LI 081, HP BLC7000 DDR2 ENCL MGMT OPTION. 456204-B21, 1, EA; LI 082, FACTORY INTEGRATION (MANUFACTURER). 1456204-B21 0D1, 1, EA; LI 083, HP BLC7000 1PH FIO POWER MODULE OPT. 413379-B21, 1, EA; LI 084, HP 3Y 4HR 24X7 HW SUPPORT. HA107A3, 1, EA; LI 085, HP VCEM BL-C7000 SW SUPPORT HP 3Y VCEM. HA107A3 7X8, 1, EA; LI 086, HP 3Y 4HR 24X7 HW SUPPORT. HA104A3, 1, EA; LI 087, HP C7000 ENCLOSURE HW SUPP. HAl04A37FX, 1, EA; LI 088, HP C7000 ENCLOSURE HW SUPPORT. HA104A3 7XE, 16, EA; LI 089, HP INSTALLATION AND STARTUP SERVICE. HA11 4Al, 1, EA; LI 090, HP STARTUP BLADESYS C-CLASS INFRASTR SVC. HA114A15FY, 1, EA; LI 091, HP BLC7000 10K RACK SHIP BRKT OPT KIT. 433718-B21, 1, EA; LI 092, FACTORY INTEGRATION (MANUFACTURER). 433718-B21 0D1, 1, EA; LI 093, HP ETHERNET 4FT CAT5E RJ45 M/M CABLE. C7533A, 2, EA; LI 094, FACTORY INTEGRATION (MANUFACTURER)C7533A 0D1, 2, EA; LI 095, HP PWR MONITORING PDU. AF916A, 2, EA; LI 096, FACTORY INTEGRATION (MANUFACTURER). AF916A 0D1, 2, EA; LI 097, HP (2) PDU EXTENSION BARS (7) C13, C19 INPUT INTL. AF500A, 1, EA; LI 098, FACTORY INTEGRATION (MANUFACTURER). AF500A 0D1, 1, EA; LI 099, HP 10K RACK AIRFLOW OPTIMIZATION KIT. AF090A, 1, EA; LI 100, FACTORY INTEGRATION (MANUFACTURER). AF090A B01, 1, EA; LI 101, HP 10K G2 600W STABILIZER KIT. AF062A, 1, EA; LI 102, FACTORY INTEGRATION (MANUFACTURER). AF062A B01, 1, EA; LI 103, HP 10642 G2 SIDEPANEL KIT. AF054A, 1, EA; LI 104, FACTORY INTEGRATION (MANUFACTURER). AF054A 0D1, 1, EA; LI 105, HP BLADE SYSTEM C-CLASS 10-GBE CX4 CABLE OPTION, 1M. 444477-B22, 2, EA; LI 106, 10-GBE CX4 CABLE OPTION, 1M. 1444477-B22 0D1, 2, EA; LI 107, HP INSTALLATION SERVICE. HA113A1, 1, EA; LI 108, RACK AND RACK OPTIONS INSTALLATION. HA113Al 5BY, 1, EA; LI 109, HP 8/GB SHORTWAVE B-SERIES FIBRE CHANNEL SFP+. AJ716A, 24, EA; LI 110, HP 10642G2 200MM EXTN SHOCK RACK. AF034A, 1, EA; LI 111, HP FACTORY EXPRESS BASE RACKING. AF034A 001, 1, EA; LI 112, HP BLC7000 CTO 3 IN LCD ROHS ENCL. 507019-B21, 1, EA; LI 113, FACTORY INTEGRATION (MANUFACTURER)507019-B21 0D1, 1, EA; LI 114, HP VCEM BL-C7000 NM 1-ENCL LIC. 459864-B21, 1, EA; LI 115, FACTORY INTEGRATION (MANUFACTURER)459864-B21 0D1, 1, EA; LI 116, HP BL490C G6 CTO BLADE. 498357-B21, 11, EA; LI 117, FACTORY INTEGRATION (MANUFACTURER). 498357-B21 0D1, 11, EA; LI 118, HP X5670 BL490C G6 FIO KIT. 595826-L21, 11, EA; LI 119, HP X5670 BL490C G6 KIT. 595826-B21, 11, EA; LI 120, FACTORY INTEGRATION (MANUFACTURER). 595826-B21 0D1, 11, EA; LI 121, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 198, EA; LI 122, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 0D1, 198, EA; LI 123, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871 -B21, 11, EA; LI 124, FACTORY INTEGRATION (MANUFACTURER). 451871-D21 0D1, 11, EA; LI 125, HP BL490C G6 CTO BLADE. 498357-B21, 5, EA; LI 126, FACTORY INTEGRATION (MANUFACTURER). 498357-B21 001, 5, EA; LI 127, HP X5670 BL490C G6 FIO KIT. 595826-L21, 5, EA; LI 128, HP X5670 BL490C G6 KIT. 595826-B21, 5, EA; LI 129, FACTORY INTEGRATION (MANUFACTURER). 595826-B21 0D1, 5, EA; LI 130, HP 4GB 2RX4 PC3-10600R-9 KIT. 5OO658-B21, 90, EA; LI 131, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 0D1, 90, EA; LI 132, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871-B21, 5, EA; LI 133, FACTORY INTEGRATION (MANUFACTURER). 451871-B21 0D1, 5, EA; LI 134, HP 80GB IO ACCELERATOR FOR BLADESYSTEM. AJ876A, 5, EA; LI 135, FACTORY INTEGRATION (MANUFACTURER)AJ876A 0D1, 5, EA; LI 136, HP BLC VC FLEX-10 ETHERNET MODULE. 455880-B21, 2, EA; LI 137, FACTORY INTEGRATION (MANUFACTURER). 455880-B21 0D1, 2, EA; LI 138, HP BLC VC-FC 8GB 24-PORT OPT KIT. 466482-B21, 2, EA; LI 139, FACTORY INTEGRATION (MANUFACTURER)466482-B21 0D1, 2, EA; LI 140, HP 10GB SR SFP+ FOR BLADESYSTEM. 455883-B21, 16, EA; LI 141, FACTORY INTEGRATION (MANUFACTURER). 455883-B21 0D1, 16, EA; LI 142, HP 2400W HIGH EFFICIENCY POWER SUPPLY. 499243-B21, 6, EA; LI 143, FACTORY INTEGRATION (MANUFACTURER). 499243-B21 0D1, 6, EA; LI 144, HP BLC7000 ENCL SINGLE FAN OPTION. 412140-B21, 6, EA; LI 145, FACTORY INTEGRATION (MANUFACTURER). 412140-B21 0D1, 6, EA; LI 146, HP BLC7000 DDR2 ENCL MGMT OPTION. 456204-B21, 1, EA; LI 147, FACTORY INTEGRATION (MANUFACTURER). 1456204-B21 0D1, 1, EA; LI 148, HP BLC7000 1PH FIO POWER MODULE OPT. 413379-B21, 1, EA; LI 149, HP 3Y 4HR 24X7 HW SUPPORT. HA104A3, 1, EA; LI 150, HP C7000 ENCLOSURE HW SUPP. HA104A31FX, 1, EA; LI 151, HP C7000 ENCLOSURE HW SUPPORT. HA104A37XE, 16, EA; LI 152, HP INSTALLATION AND STARTUP SERVICE. HA114Al, 1, EA; LI 153, HP STARTUP BLADESYS C-CLASS INFRASTR SVC. HA114A1 5FY, 1, EA; LI 154, HP BLC7000 10K RACK SHIP BRKT OPT KIT0. 4337 18-B21, 1, EA; LI 155, FACTORY INTEGRATION (MANUFACTURER). 433718-B21 0D1, 1, EA; LI 156, HP BLC7000 CTO 3 IN LCD ROHS ENCL. 507019_B21, 1, EA; LI 157, FACTORY INTEGRATION (MANUFACTURER). 507019-B21 0D1, 1, EA; LI 158, HP VCEM BL-C7000 NM 1-ENCL LIC. 459864-B21, 1, EA; LI 159, FACTORY INTEGRATION (MANUFACTURER). 459864-B21 0D1, 1, EA; LI 160, HP BL490C G6 CTO BLADE. 498357-B21, 11, EA; LI 161, FACTORY INTEGRATION (MANUFACTURER). 498357-B21 0D1, 11, EA; LI 162, HP X5670 BL490C G6 FIO KIT.595826-L21, 11, EA; LI 163, HP X5670 BL490C G6 KIT. 59582-B21, 11, EA; LI 164, FACTORY INTEGRATION (MANUFACTURER). 595826-B21 0D1, 11, EA; LI 165, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 198, EA; LI 166, FACTORY INTEGRATION (MANUFACTURER). 500658-B1 0D1, 198, EA; LI 167, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871-B21, 11, EA; LI 168, FACTORY INTEGRATION (MANUFACTURER). 451871-B21 0D1, 11, EA; LI 169, HP BL490C G6 CTO BLADE. 498357-B21, 5, EA; LI 170, FACTORY INTEGRATION (MANUFACTURER)., 5, EA; LI 171, HP X5670 BL490C G6 FIO KIT. 498357-B1 0D1, 5, EA; LI 172, HP X5670 BL490C G6 KIT. 595826-L21, 5, EA; LI 173, FACTORY INTEGRATION (MANUFACTURER)595826-B21, 5, EA; LI 174, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 90, EA; LI 175, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 0D1, 90, EA; LI 176, HP B:C QLOGIC QMH2562 8GB FC HBA. 451871-B21, 5, EA; LI 177, FACTORY INTEGRATION (MANUFACTURER). 451871-B21 0D1, 5, EA; LI 178, HP 80GB IO ACCELERATOR FOR BLADESYSTEM. AJ876A, 5, EA; LI 179, FACTORY INTEGRATION (MANUFACTURER). AJ876A 0D1, 5, EA; LI 180, HP BLC VC FLEX-10 ETHERNET MODULE. 455880-B21, 2, EA; LI 181, FACTORY INTEGRATION (MANUFACTURER). 455880--B21 0D1, 2, EA; LI 182, HP BLC VC-FC 8GB 24-PORT OPT KIT. 466482-B21, 2, EA; LI 183, FACTORY INTEGRATION (MANUFACTURER). 466482-B21 0D1, 2, EA; LI 184, HP 10GB SR SFP+ FOR BLADESYSTEM. 455883-B21, 16, EA; LI 185, FACTORY INTEGRATION (MANUFACTURER). 455883-B21 0D1, 16, EA; LI 186, HP 2400W HIGH EFFICIENCY POWER SUPPLY. 499243-B21, 6, EA; LI 187, FACTORY INTEGRATION (MANUFACTURER)499243-621 0D1, 6, EA; LI 188, HP BLC7000 ENCL SINGLE FAN OPTION. 412140-B21, 6, EA; LI 189, FACTORY INTEGRATION (MANUFACTURER). 412140-B21 0D1, 6, EA; LI 190, HP BLC7000 DDR2 ENCL MGMT OPTION. 456204-B21, 1, EA; LI 191, HP BLC7000 1PH FIO POWER MODULE OPT. 456204-B21 0D1, 1, EA; LI 192, FACTORY INTEGRATION (MANUFACTURER). 413379-B21, 1, EA; LI 193, HP 3Y 4HR 24X7 HW SUPPORT. HA 107AJ, 1, EA; LI 194, HP VCEM BL-C7000 SW SUPPORT HP 3Y VCEM. HA107A37XB, 1, EA; LI 195, HP 3Y 4HR 24X7 HW SUPPORT. HA104A3, 1, EA; LI 196, HP C7000 ENCLOSURE HW SUPP. HAl04A37FX, 1, EA; LI 197, HP C7000 ENCLOSURE HW SUPPORT. HAl04A37XE, 16, EA; LI 198, HP INSTALLATION AND STARTUP SERVICE. HA114Al, 1, EA; LI 199, HP STARTUP BLADESYS C-CLASS INFRASTR SVC. HA114A15FY, 1, EA; LI 200, HP BLC7000 10K RACK SHIP BRKT OPT KIT. 433718-B21, 1, EA; LI 201, FACTORY INTEGRATION (MANUFACTURER). 433718-B21 0D1, 1, EA; LI 202, HP ETHERNET 4FT CAT5E RJ45 M/M CABLE. C7533A, 2, EA; LI 203, FACTORY INTEGRATION (MANUFACTURER). C7533A 0D1, 2, EA; LI 204, HP PWR MONITORING PDU. AF916A, 2, EA; LI 205, FACTORY INTEGRATION (MANUFACTURER). AF916A 0D1, 2, EA; LI 206, HP (2) PDU EXTENSION BARS,(7) C13, C19 INPUT INTL. AF500A, 1, EA; LI 207, FACTORY INTEGRATION (MANUFACTURER). AF500OA 0D1, 1, EA; LI 208, HP 10K RACK AIRFLOW OPTIMIZATION KIT. AF090A, 1, EA; LI 209, FACTORY INTEGRATION (MANUFACTURER)AF090A B01, 1, EA; LI 210, HP 10K G2 600W STABILIZER KIT. AF062A, 1, EA; LI 211, FACTORY INTEGRATION (MANUFACTURER). AF062A B01, 1, EA; LI 212, HP 10642 G2 SIDEPANEL KIT. AF054A, 1, EA; LI 213, FACTORY INTEGRATION (MANUFACTURER). AF054A 0D1, 1, EA; LI 214, HP BLADE SYSTEM C-CLASS 10-GBE CX4 CABLE OPTION, 1M. 444477-B22, 2, EA; LI 215, FACTORY INTEGRATION (MANUFACTURER). 444477-B22 0D1, 2, EA; LI 216, HP INSTALLATION SERVICE. HA113A1, 1, EA; LI 217, RACK AND RACK OPTIONS INSTALLATION. HA113A1 5BY, 1, EA; LI 218, HP 8/GB SHORTWAVE B-SERIES FIBRE CHANNEL SFP+. AJ716A, 24, EA; LI 219, HP CTO PROLIANT DL360 G6 SERVER. 484184-B21, 1, EA; LI 220, HP U.S. - ENGLISH LOCALIZATION. 484184-B21 ABA, 1, EA; LI 221, HP PROCESSOR, XEON QC E5540 2.54GHZ, 8MB L3 CACHE, KIT FOR DL360 G6. 505880-L21, 1, EA; LI 222, HP PROCESSOR, XEON QC E5540 2.54GHZ, 8MB L3 CACHE, KIT FOR DL360 G6. 505880-B21, 1, EA; LI 223, FACTORY INTEGRATION (MANUFACTURER). 505880-B21 0D1, 1, EA; LI 224, HP 4GB 2RX4 PC3-10600R-9 KIT. 500658-B21, 8, EA; LI 225, FACTORY INTEGRATION (MANUFACTURER). 500658-B21 0D1, 8, EA; LI 226, HP 146GB 10K SAS 2.5 DP HARD DISK DRIVE. 507125-B21, 2, EA; LI 227, FACTORY INTEGRATION (MANUFACTURER). 507125-B21 0D1, 2, EA; LI 228, HP 12.7MM SATA DVD-RW DRIVE. 532068-B21, 1, EA; LI 229, FACTORY INTEGRATION (MANUFACTURER). 532068-B21 0D1, 1, EA; LI 230, HP 512MB P-SERIES BBWC (FOR HP SA P410 OR P411 CONTROLLERS).462967-B21, 1, EA; LI 231, FACTORY INTEGRATION (MANUFACTURER). 462967-B21 0D1, 1, EA; LI 232, HP 82Q 8GB 2-PORT PCIE FC HBA. A J764A, 1, EA; LI 233, FACTORY INTEGRATION (MANUFACTURER). AJ764A 0D1, 1, EA; LI 234, ADP SUPPORT EQUIPMENT - HP CTO 460 WATT HE 12VHOT-PLUG AC P / S KIT. 503296-B21, 2, EA; LI 235, FACTORY INTEGRATION (MANUFACTURER). 503296-B21 0D1, 2, EA; LI 236, HP E5540 DL360 G6 FIO KIT. HAl04A3, 1, EA; LI 237, HP PROLIANT SERVER DL36X HW SUPP. HA104A3 7G2., 1, EA; LI 238, CTO Proliant DL360 G6 Server. 484184-B21, 3, EA; LI 239, 484184-B21 ABA.U.S. - English localization, 3, EA; LI 240, Processor. Xeon QC E5540 2.53GHz. 8MB L3 Cache, Kit forDL360 G6. 505880-L21, 3, EA; LI 241, 505880-B21. HP PROCESSOR, XEON QC E5540 2.54GHZ, 8MB L3 CACHE, KIT FOR DL360 G6, 3, EA; LI 242, 505880-B21 0D1. HP FACTORY INTEGRATED, 3, EA; LI 243, 500658-B21. HP 4GB 2RX4 PC3-10600R-9 KIT, 24, EA; LI 244, 500658-B21 0D1. HP FACTORY INTEGRATED, 24, EA; LI 245, 507125-B21. HP 146GB 10K SAS 2.5 DP HARD DISK DRIVE, 6, EA; LI 246, 507125-B21 0D1. FACTORY INTEGRATED, 6, EA; LI 247, 532068-B21. HP 12.7MM SATA DVD-RW DRIVE, 3, EA; LI 248, 532068-B21 0D1. FACTORY INTEGRATED, 3, EA; LI 249, 462967-B21. HP 512MB P-SERIES BBWC (FOR HP SA P410 OR P411 CONTROLLERS), 3, EA; LI 250, 462967-B21 0D1. HP FACTORY INTEGRATED, 3, EA; LI 251, 503296-B21. HP CTO 460 WATT HE 12V HOT-PLUG AC P / S KIT, 6, EA; LI 252, 503296-B21 0D1 FACTORY INTEGRATED, 6, EA; LI 253, HA104A3 HP 3YR 4HR 24X7 HW SUPPORT, 1, EA; LI 254, HA104A3 7G2 HP PROLIANT SERVER DL36X HW SUPP, 3, EA; Solicitation and Buy Attachments ***Question Submission: Interested offerors must submit any questions concerning the solicitation at the earliest time possible to enable the Buyer to respond. Questions must be submitted by using the 'Submit a Question' feature at www.fedbid.com. Questions not received within a reasonable time prior to close of the solicitation may not be considered.*** For this solicitation, Department of State intends to conduct an online competitive reverse auction to be facilitated by the third-party reverse auction provider, FedBid, Inc. FedBid has developed an online, anonymous, browser based application to conduct the reverse auction. A Seller may submit a series of pricing bids, which descend in price during the specified period of time for the aforementioned reverse auction. Department of State is taking this action in an effort to improve both seller access and awareness of requests and the agency's ability to gather multiple, completed, real-time bids. All responsible Sellers that respond to this solicitation MUST submit the pricing portion of their bid using the online exchange located at www.FedBid.com. There is no cost to register, review procurement data or make a bid on www.FedBid.com. Sellers that are not currently registered to use www.FedBid.com should proceed to www.FedBid.com to complete their free registration. Sellers that require special considerations or assistance may contact the FedBid Helpdesk at 877-9FEDBID (877-933-3243) or via email at clientservices@fedbid.com. Sellers may not artificially manipulate the price of a transaction on www.FedBid.com by any means. It is unacceptable to place bad faith bids, to use decoys in the www.FedBid.com process or to collude with the intent or effect of hampering the competitive www.FedBid.com process. Should Sellers require additional clarification, contact FedBid at 877-9FEDBID (877-933-3243) or clientservices@fedbid.com. Use of FedBid: Buyers and Sellers agree to conduct this transaction through FedBid in compliance with the FedBid Terms of Use. Failure to comply with the below terms and conditions may result in offer being determined as non-responsive. New equipment ONLY, NO remanufactured products Bid MUST be good for 30 calendar days after submission FOB Destination CONUS (CONtinental U.S.) No partial shipments unless otherwise specified: Agencies may require registration with the Central Contractor Registry (CCR) or to receipt of order. Information can be found at www.ccr.gov LOW COST, TECHNICAL ACCEPTABLE, DELIVERY TIME The Contractor and its employees shall exercise the utmost discretion in regard to all matters relating to their duties and functions. They shall not communicate to any person any information known to them by reason of their performance of services under this contract which has not been made public, except in the necessary performance of their duties or upon written authorization of the Contracting Officer. All documents and records (including photographs) generated during the performance of work under this contract shall be for the sole use and become the exclusive property of the U.S Government. Furthermore, no article, book, pamphlet, email, recording, broadcast, speech television appearance, film or photograph concerning any aspect of work performed under this contract shall be published or disseminated through any media without the prior written authorization of the Contracting Officer. These obligations do no cease upon the expiration or termination of this contract. The Contractor shall include the substance of this provision in all contracts of employment and in all subcontracts hereunder. A) Sellers must bid exact match to spec (make, model and spec) B)The products offered in this bid are brand new, not gray market and are in original packaging. C) Seller is providing these products via Hewlett Packard authorized channels for new equipment Federal sales. D) Full Hewlett Packard warranties will be provided and none of these products will have a negative impact on the warranties of associated system components. This procurement action is being funded with supplemental appropriations provided by the American Recovery and Re-Investment Act of 2009 (ARRA), Pub. L. 111-5. It is the intention of the Department of State to issue a bilateral contract resulting from this solicitation, which, in addition to other contract clauses, will incorporate commercial contract clauses specific to ARRA procurements. Contract clauses will include: FAR 52.212-5 Contract Terms and Conditions Required to Implement Statutes or Executive OrdersCommercial Items (Alternate II May 2009), 52.203-15 Whistleblower Protections Under the American Recovery and Reinvestment Act of 2009 (Mar 2009), 52.204-11 American Recovery and Reinvestment ActReporting Requirements (Mar 2009), and 52.214-26 Audit and RecordsSealed Bidding (Mar 2009). The awardee must also submit a copy of all invoices to the Contracting Officer and/or Contract Specialist named on page 1 of the contract, for recording purposes. Failure to furnish a copy of all invoices accordingly may result in denied invoice approval and/or payment. Review attachment If Seller is bidding Cisco brand equipment, Seller certifies that it is a Cisco Authorized Channel as of the date of the submission of its Bid, and that it has the certification/specialization level required by Cisco to support both the product sale and product pricing, in accordance with applicable Cisco certification/specialization requirements. Unless otherwise specified, Seller warrants that the products are new and in their original box(es). The Seller confirms to have sourced all Cisco products submitted in this Bid from Cisco or through Cisco Authorized Channels only, in accordance with all applicable laws and Ciscos current applicable policies at the time of purchase. If software is provided or included, Seller shall, upon request, provide Buyer with a copy of the End User License Agreement. Seller certifies that all Cisco software is licensed originally to Buyer as the original licensee authorized to use the Cisco Software.
 
Web Link
FBO.gov Permalink
(https://www.fbo.gov/spg/State/FedBid.com/FedBid1/101903C008_02/listing.html)
 
Place of Performance
Address: WASHINGTON, DC 20520
Zip Code: 20520
 
Record
SN02186408-W 20100625/100623235442-ee1935724255be57a3a2183cccda7941 (fbodaily.com)
 
Source
FedBizOpps Link to This Notice
(may not be valid after Archive Date)

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