SOLICITATION NOTICE
59 -- Multi-chip Die Bonder with Integrated Dispenser Install, Training, and Maintenance
- Notice Date
- 4/26/2010
- Notice Type
- Combined Synopsis/Solicitation
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Other Defense Agencies, Defense Microelectronics Activity, Defense Microelectronics Activity, 4234 54th Street, McClellan, California, 95652, United States
- ZIP Code
- 95652
- Solicitation Number
- H94003-10-R-5611
- Archive Date
- 6/30/2010
- Point of Contact
- Colten J, Murray, Phone: 9162311517, Linda Baustian, Phone: 9162311658
- E-Mail Address
-
murray@dmea.osd.mil, baustian@dmea.osd.mil
(murray@dmea.osd.mil, baustian@dmea.osd.mil)
- Small Business Set-Aside
- N/A
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. This announcement constitutes the solicitation. The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-39. The NAICS Code is 334413 with a size standard of 500 employees. The reference number is H94003-10-R-5611. The place of performance and delivery is Defense Microelectronics Activity (DMEA), 4234 54th Street, McClellan, CA 95652. This contract has a basic year with 4 option years of preventative maintenance. The contractor shall provide a multi-chip die bonder with integrated dispenser. This equipment must conform to the following salient characteristics: 01) Machine capability 10 µm at 3 sigma at a throughput up to 5,000 units per hour. 02) Stereo Microscope with Magnification 4x min. And 26.5x max. 03) XYZ linear motors, 0.2 micron resolution encoders. 04) Theta axis rotary bond-head, theta range: 0 o - 360 o, minimum increments 0.0045 o. 05) CMOS substrate camera/optics/illumination. 06) Minimum of three (3) cameras (upward-looking, wafer and substrate cameras). 07) Vision pattern recognition system with edge, gray level, and pattern and ink-dot recognition. 08) Programmable lighting systems with Red Green Blue (RGB) light. 09) Menu-driven by Integrated ETX-based industry PC and Linux GUI. 10) Fully automated calibration to include integrated quality checks for dispensing and bonding. 11) Automatic calibration of Z-height - utilizing mechanical touchdown detection. 12) 'Z' positional bonding capable. 13) Die, substrate, module and bond position height measurement capable. 14) Automatic substrate transport system. 15) 7000 gram bond-force capable. 16) Bond-force sensor and Basic Machine Capability kit to include tool set-up glass die and glass board target. 17) Force or positional bonding capable. 18) Ability to pick from wafer frame, hoop ring and waffle pack with single process recipe. 19) Capable of die sorting to waffle or gel pack with custom carrier. 20) Field upgradeable to wafer cassette handling (up to 25 slot capacity) and processing of 25 different wafers. 21) Field upgradeable chip flipper and fluxer for flip chip die attach with 10 µm @ 3 sigma accuracy. 22) SMEMA compatible interface. 23) Minimum heated substrate capability up to 180 o C and heated bond-head capability up to 350 o C. 24) Substrate transport system with substrate heating for automatic transport system, to include heating, cooling, controller, and one customized bonding insert for up to 180 o C and heated bonding insert for automatic transport system 180 o C achievable based upon product spec. 25) Component presentation system to include wafer table without stretcher - Automatic indexing of wafer/waffle pack holder beneath wafer camera and static 6-up waffle pack (2') holder. 26) Adapters and magazines with waffle pack 2' holder for automatic change (on an 8' wafer frame format) to hold a minimum of 12, 2' waffle packs. 27) Die handling system for heated bond head and automatic pick-up tool changer unit 7-slot. 28) Tool holders and tools including standard tool holder, heated tool holder with changeable tip capability up to 350 o C, and pick and place epoxy stamping tool. 28) Ejection System including single-chip ejector unit with automatic exchange of ejection tools and multi-chip ejection carousel. 28) Eject Tools base and needle kit. 29) Epoxy and flux application system with a high-performance D-style pump volumetric auger style dispenser. 30) The following accessories: step-up transformer, any and all calibration tools/kit, and connection kit (Tubes, fittings, cables). 31) SECS/GEM capability including wafer mapping software and wafer barcode scanner. 32) UV cure system that allows for UV switching, integrated into machine control. Only new equipment is acceptable. The equipment shall also provide the following capabilities: 01) 12' wafer handling, 02) multi-chip module, 03) system in package, 04) CMOS application, 05) single chip application, 06) ball grid array, 07) stacked die applications, 08) chip on board, 09) configurable with integrated dispenser, and 10) data transfer via TCP/IP network. The contractor shall be responsible for the installation, training, and maintenance. The contractor shall provide on-site hardware and software warranties for a period of 1 year for the items identified in this solicitation. Warranty shall include repair/replacement for: a) Defects in materials and workmanship b) Dust, internal overheating, internal humidity/condensation c) Power surge/fluctuations and d) Software deficiencies. The contractor shall propose a preventative maintenance plan for four option years after the one year warranty period. The contractor is required to provide a twenty-four (24) hour advance notification prior to conducting any on-site inspection, installation or maintenance for security purposes. All installation and maintenance work shall be performed by US citizens. Contractor personnel shall provide proof of citizenship in accordance with the DMEA visitor approval process in effect at the time the visit is requested and prior to being allowed entry into either location. FOB point is Destination. The Service Contract applies to this solicitation and the Wage Determination information will be included as an attachment with the RFP package. Award will be made to the lowest responsive, responsible offer including options submitted in response to this requirement. The following FAR clauses apply: 52.212-1, Instructions to Offerors - Commercial; 52.212-3, Offeror Representations and Certifications-Commercial Items; 52.212-4 Contract Terms and Conditions-Commercial Items; 52.212-5, Contract Terms and Conditions required to Implement Statutes or Executive Orders-Commercial Items; 52.217-5, Evaluation of Options; 52.217-8, Option to Extend Services; 52-217-9, Option to Extend the Term of the Contract; 52.252-1, Solicitation Provisions Incorporated by Reference. DFARS clause 252.212-7001, Contract Terms and Conditions requires to Implement Statutes or Executive Orders Applicable to Defense Acquisition of Commercial Items. DPAS Rating is C9E. For a complete copy of the Statement of Work (SOW) and a Request for Proposal (RFP) please email Colten Murray at murray@dmea.osd.mil. Offers shall be received in DMEA by 4:00pm (PST) 26 May 2010.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/ODA/DMEA/DMEA/H94003-10-R-5611/listing.html)
- Place of Performance
- Address: 4234 54th Street, McClellan, California, 95652, United States
- Zip Code: 95652
- Zip Code: 95652
- Record
- SN02131876-W 20100428/100426234549-68122134e6b9bc34144519f8a72725fc (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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