SOURCES SOUGHT
66 -- Reactive Ion Etcher System for Metals
- Notice Date
- 11/23/2009
- Notice Type
- Sources Sought
- NAICS
- 334516
— Analytical Laboratory Instrument Manufacturing
- Contracting Office
- Department of Energy, Brookhaven National Laboratory (DOE Contractor), Brookhaven, PO Box 5000, Bldg. No. 355, Upton, New York, 11973
- ZIP Code
- 11973
- Solicitation Number
- VC156528
- Archive Date
- 12/30/2009
- Point of Contact
- Vincent Costanzo, Phone: 631-344-5539, ,
- E-Mail Address
-
vcostanzo@bnl.gov,
(vcostanzo@bnl.gov, /div)
- Small Business Set-Aside
- N/A
- Description
- Technical Specifications for a n ICP Reactive Ion etch system: Preamble The Brookhaven National Laboratory, herein known as BNL, operated by Brookhaven Science Associates, under Prime Contract No. DE-AC02-98CH10886, with the U.S. Department of Energy, herewith solicits your quote for a Plasma Etch System and its hazard gas deliver and waste treatment system. A. Plasma Etch system (main unit) 1. General This system will provide a means for plasma etching of thin film materials using a variety of different reactive gas chemistries in a radio frequency (RF) plasma. System will provide control of vacuum chamber pressure, independent control of twelve gas channels, ICP and RF plasma power up, processing time, and substrate temperature. System will provide end point detection capability. System Dimensions : The plasma etch system shall fit within a lateral footprint of 3' x 6' (3 feet by 6 feet), including vacuum chamber, loadlock chamber, power generators and attached gas mass flow controllers. If it is detached, gas mass flow controllers unit shall be able to be mounted on a wall and the depth should not exceed 1 foot. The vacuum chamber shall be large enough to accommodate up to a single 6" (six inch) diameter round sample, while also accepting any smaller size sample piece of arbitrary shape. Process Gases : The system is mainly meant for using toxic gases, such as Cl-containing gases. Process gases will include Cl 2, BCl 3, SiCl 4, HBr, CH 4, H 2, Ar, O 2, N 2, SF 6, C 4 F 8, CF 4. The plasma etch tool shall include twelve (12) mass flow controllers (MFC s ) for independent programmable control of twelve different process gases. Flow rates shall be calibrated for each gas and shall be capable of flow rates of between 0 and 100 sccm. Each of the gas line must be compatible with its process gas (SiCl 4, for example). System Vacuum : The process chamber and loadlock chamber shall be pumped independently. The process chamber shall be pumped by a turbo molecular pump backed by a rough mechanical pump (dry pump preferred) with a speed of at least 500 l/s and shall achieve an ultimate pressure of at least 0.01 mT or below. The process chamber pressure shall be programmable for processing pressures between 0.5 mT and 100 mT. The loadlock chamber shall be pumped by a turbo molecular pump backed by a rough mechanical pump (dry pump preferred) with a speed of at least 50 l/s and shall achieve an ultimate pressure of at least 0.01 mT or below. The system shall include an automated system pumpdown procedure. The system shall include all vacuum pumps. All the vacuum pumps shall be compatible with the process gases listed above. The system shall reach ultimate pressure in a time no longer than 5 min of pumping in a standard laboratory environment. ICP and RF Power : The system shall use (ICP and RF power) 13.56MHz to generate a plasma. The range of applied ICP power will be programmable between 0W and 3000W and the independent RF power will be be programmable between 0W and 300W. The tool shall include an auto-tuning mechanism to impedance match the input RF power. The ICP plasma shall uniformly cover at least a 100 mm wafer area. Substrate Temperature: The system shall provide an automatic substrate temperature control with temperature ranging from -140 o C to 400 o C with fluctuation smaller than +/-3 o C. End point detector: The system shall provide an optical emission endpoint detector (EPD) and reserve the expanding capability for a laser interferometer endpoint detector (interface to HORIBA JOBIN YVON LEM endpoint detector is recommended). The process control software shall have an integrated module handling process according to the received EPD signal. The detector shall cover spectra ranging from 200 nm to 800 nm. The software shall be able to monitor multiple channels simultaneously. Operator shall be able to check the full spectra during etching. Process automation and recipe management : The system shall allow both manual and automatic etching processes execution. The system shall provide mechanism to organize and run multi-step processes as recipes. The system shall provide software interface for composing, modifying, saving and loading process recipes. Safety : The system shall be equipped with an emergency shutoff. The system shall include interlocks to prevent user operation under unsafe conditions. The system software shall provide user account with configurable access level. Additions : The system shall provide solution to enable plasma process at a pressure ranging from 1 mTorr to 100 mTorr. The system shall be a well proved model with at least 30 systems of this kind being installed and operating worldwide. The whole system (except rough vacuum pumps) shall be compatible with class 1000 cleanroom. 2. System Support •a. The Seller shall supply operating and service manuals for the plasma etch system and accessories. Operating manuals (paper and electronic copies) shall provide detailed description for all modes of operation detailed in this specification. Service manuals shall include detailed procedures for standard maintenance operations. •b. The seller shall provide a two-year warranty on all parts and labor commencing with BNL's acceptance of the installed and tested plasma etch system. •c. The Seller shall provide service coverage with a service contract. A service contract shall include at least one preventative maintenance visit per year, unlimited visits for on-site repairing and unlimited telephone and email troubleshooting and process consulting. On-site visits shall occur in less than five working days after receiving repairing request. •d. The Seller shall provide a recommended spare parts list and at the time of delivery provide consumable parts for one year. •e. Quality Assurance Requirements set forth in BNL Form BNL-QA-101, as amended, are hereby incorporated into this specification. •f. The Seller shall provide 2-3 days of training, on-site, for operators in the use and routine maintenance of the instrument. •g. The Seller shall provide basic etching receipts for Al, Al 2 O 3, AlN, Au, Cu, Cr, GaAs, GaN, InP, ITO, PZT, Ta, Ti, TiO 2, W and WSi2. B. Off Loading and Rigging - The Seller shall be responsible for all offloading and rigging. The system shall be crated and shipped in packaging crates that pass through all doorways in the designated building between the loading dock area and the laboratory, in which it will be installed. Vendor representatives on the BNL site must be qualified to obtain site access. All vendor representatives will also need to take appropriate safety training as determined by the BNL work planning process. C. Installation - The Seller shall be responsible for installation of all components and provision of all interconnecting power, communication, control and instrument cabling, and all liquid and gas piping, and tubing between components and to the supply points identified by BSA. Seller shall be responsible for providing all materials and supplies required for installation and for verification of specified performance. All installation work shall be in accordance with applicable National Codes. D. Configuration - The Seller shall provide a marked up sketch indicating approximate locations of components to be provided as part of their proposal and final configuration drawings if awarded contract. The Seller shall provide BSA the plasma etch system installation guide or in the alternative, detailed requirements concerning all building utility and interface connections. Within 30 days after contract award the Seller shall participate in a meeting to discuss the technical aspects of the planned systems configuration and installation. The Seller shall be prepared to review laboratory connection points to ensure compatibility with the plasma etch system installation and to discuss installation methodology, schedule, quality assurance requirements and applicable technical issues. E. Performance - Instrument performance shall be based on the available environmental conditions as described in the Appendix 1. The seller has to identify in the proposal if and how additional or improved instrument performance can be achieved under more stringent environmental conditions. F. Testing - The seller shall test the plasma etcher at the seller's facility prior to shipment to BNL. The test shall be performed using a test procedure prepared by the seller and approved by BNL. After installation at BNL, all or a portion of the test procedure, as determined by BNL, shall be repeated by the seller, using the seller's test equipment. All testing shall be witnessed by BNL representatives.
- Web Link
-
FBO.gov Permalink
(https://www.fbo.gov/spg/DOE/BHL/BNL/VC156528/listing.html)
- Place of Performance
- Address: Brookhaven National Laboratory, Upton, New York, 11973, United States
- Zip Code: 11973
- Zip Code: 11973
- Record
- SN02009594-W 20091125/091123235549-2f9f7d2fc732484e542a400223b0c361 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
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