SOURCES SOUGHT
66 -- RECOVERY-FURNACE SYSTEM FOR HIGH TEMPERATURE PROCESSING OF SILICON WAFERS
- Notice Date
- 3/26/2009
- Notice Type
- Sources Sought
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Department of Commerce, National Institute of Standards and Technology (NIST), Acquisition Management Division, 100 Bureau Drive, Building 301, Room B129, Mail Stop 1640, Gaithersburg, Maryland, 20899-1640
- ZIP Code
- 20899-1640
- Solicitation Number
- AMD-09-SS26
- Archive Date
- 4/25/2009
- Point of Contact
- Todd D Hill, Phone: 301-975-8802
- E-Mail Address
-
todd.hill@nist.gov
- Small Business Set-Aside
- N/A
- Description
- The National Institute of Standards & Technology (NIST) seeks information on commercial vendors that are capable of providing a furnace system for high temperature processing of silicon wafers. The furnace system will be installed in a clean room at NIST in Boulder, CO. Both low pressure chemical vapor deposition (LPCVD) and atmospheric processes will be required. The furnaces will be used for fabricating microelectromechanical (MEMS) devices for a wide variety of sensor, imaging, ion confinement and biomagnetic research projects it NIST. After results of this market research are obtained and analyzed and specifications are developed for a furnace system that can meet NIST's minimum requirements, NIST may conduct a competitive procurement and subsequently award a Purchase Order. If at least two qualified small businesses are identified during this market research stage, then any competitive procurement that resulted would be conducted as a small business set-aside. This contemplated procurement is anticipated to use Recovery Act Funding if it is determined that responsible sources can satisfy the requirements. NIST has a need for a furnace system for high temperature processing of silicon wafers that would meet the following requirements: 2 banks, 8 tubes Capable of processing 3,4 and 6" wafers Tube/process list: LPCVD Low Stress Silicon Nitride LPCVD Stoichiometric Silicon Nitride LPCVD Poly silicon LPCVD Low Temp Oxide Wet/dry oxidation Nitrogen/Forming Gas Anneal Solid source boron doping of silicon wafers Solid source phosphorous doping of silicon wafers Dry pumps with blowers on all LPCVD tubes Option - spare pump and blower 2 sets of quartz-ware for 3,4, 6" wafers for all tubes Spare parts kit Proven recipes for the above processes Dual cylinder, automatic purge panel gas cabinets for DCS, NH3, Silane, hydrogen Pump exhaust CDO/scrubber abatement system for all pump exhausts NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 334516, as those domestic sources having 500 employees or less. Please include your company’s size classification in any response to this notice. Companies that manufacture silicon processing furnace systems are requested to email a detailed report describing their abilities to todd.hill@nist.gov no later than the response date for this sources sought notice. The report should include achievable specifications and any other information relevant to your product or capabilities. Also, the following information is requested to be provided as part of the response to this sources sought notice: 1. Name of the company that manufactures the system components for which specifications are provided. 2. Name of company(ies) that are authorized to sell the system components, their addresses, and a point of contact for the company (name, phone number, fax number and email address). 3. Indication of number of days, after receipt of order that is typical for delivery of such systems. 4. Indication of whether each instrument for which specifications are sent to todd.hill@nist.gov are currently on one or more GSA Federal Supply Schedule contracts and, if so, the GSA FSS contract number(s). 5. Any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research.
- Web Link
-
FedBizOpps Complete View
(https://www.fbo.gov/?s=opportunity&mode=form&id=6f357b59030f011a7115e860a11ce744&tab=core&_cview=1)
- Place of Performance
- Address: NIST, Gaithersburg, Maryland, 20899, United States
- Zip Code: 20899
- Zip Code: 20899
- Record
- SN01778958-W 20090328/090326220812-6f357b59030f011a7115e860a11ce744 (fbodaily.com)
- Source
-
FedBizOpps Link to This Notice
(may not be valid after Archive Date)
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