SOLICITATION NOTICE
59 -- Multi-layer circuit boards
- Notice Date
- 7/6/2007
- Notice Type
- Solicitation Notice
- Contracting Office
- N68936 Naval Air Warfare Center Weapons Division Dept.1 429 E. Bowen Rd - Stop 4015 China Lake, CA
- ZIP Code
- 00000
- Solicitation Number
- N6893607T0139
- Response Due
- 7/25/2007
- Archive Date
- 1/6/2008
- Description
- The Naval Air Systems Command, Naval Air Warfare Center Weapons Division (NAVAIR WD), China Lake, CA, 93555 anticipates issuing multiple Indefinite Delivery Indefinite Quantity (IDIQ) contracts for a period of 5 years. The scope of the contract includes fabrication, testing, and delivery of high density printed circuit boards (PCBs). High density is defined as boards up to 30 layers with through, buried, and blind vias. The fabrication of the PCBs includes populating the circuit boards with electronic components. The electronic components may be government furnished material (GFM) to the contractor. The required testing and reporting of the fabricated PCBs and the component population will be provided by the contractor. ! The contractor shall be an ISO 9001 registered company, and meet the manufacturing procedures that enable the PCBs to meet the rigorous environmental requirements specified in the statement of work. The contractor shall have the engineering staff and software necessary to perform full design rule check (DRC) and design for manufacturing (DFM) on Gerber files provided by the government and shall notify NAVAIR WD design engineers of errors and/or anomalies in the Gerber files. The contractor shall work closely with NAVAIR WD design engineers and recommend changes to the Gerber files that fixes the errors, anomalies, and/or increases the yield of the PCBs. All changes will be approved by NAVAIR WD engineers before fabrication of the PCBs begins. The contractor will evaluate the impedance of the designed traces, and alert NAVAIR WD if there is difference from the specified impedance. The contractor will test the impedance of the specified traces post fabrication and in circu it. The contractor shall have the ability to fabricate high density PCBs up to 30 layers with through, buried, and blind vias. The contractor shall use a process to inspect the circuitry and vias to ensure finished PCB electrical conformity to the Gerber file. The contractor shall have the ability to maintain a PCB thickness tolerance of no greater than +/- 10% of the specified nominal board thicknesss of a given design. For board thicknesses thinner than 0.016", the board tolerance can have a minimum tolerance of +.003"/-.002". The board outline cutout tolerance shall be no more than +/-0.005". The contractor shall use processes that ensure that there is uniformity across PCB panels for both prototype and production PCBs, and provide one or more test coupons on every manufacturing panel. The test coupons shall be thermally stressed, micro-sectioned, impedance tested, and examined for PCB conformity to the Gerber file. When applicapable or specified, the contractor s hall use numerically controlled (NC) laser drilling with optical acqui sition to ensure that 4 mil minimum diameter holes can be drilled with a 1 mil tolerance. The contractor shall use a process to test continuity and isolation of board layers, traces, circuitry, and vias. All test documentation shall be delivered with each PCB. The test documentation shall be associated with the appropriate PCB by the use of a serial number. The contractor shall have the capability of populating the PCBs with electronic components, supplied as GFM from the government. The contractor and all of the contractor's ancillary support service providers shall work directly with NAVAIR WD to resolve any technical issues. The contractor shall be able to solder with the optimal process for through hole, surface mount, ball grid arrays (BGA), FineLine BGA, leadless, and custom packaged components. A dense FineLine BGA will have over 1000 contacts with a ball pitch of 1mm. All of the listed components will be soldered without bridging , gaps, or disconnects. The contractor shall also inspect the solder joints after populating the PCBs to ensure that no solder bridging and/or gaps have occurred. The inspection shall use an automated optical inspection, manual inspection, or any other optimum inspection process. Each BGAs and FineLine BGA shall have an XRAY taken post installation. A copy of each XRAY shall be delivered to the NAVAIR WD with the associated board. Each XRAY will be documented with the associated PCB serial number and with the reference designator of the inspected BGA or FineLine BGA. Each board delivered shall be accompanied with documentation of both the electrical and mechanical sufficiency of the unpopulated board. Final board operability is the responsibility of the government. To maintain the schedule requirements for this project, the manufacturer must be located within 200 miles of China Lake, CA to allow NAVAIR WD engineers to inspect the PCBs, both without and without electronic components, at the manufacturer's facility. The minimum number of PCBs to be procured is 2 with a unit issue of "each" per ID/IQ contract. For any orders in excess of the minimum quantity, each ID/IQ contractor will be given a fair opportunity to be considered. Delivery of all line items will be FOB Destination with the destination and time defined within each delivery order. Award will be issued under the authority of of the test program for commercial items (FAR 13.5). The ID/IQ contracts will be awarded using a best value analysis with the requirement that contractors meet the minimum specifications as detailed in the solicitation. It is anticipated that the solicitation will be issued on 20 July 2007 with an anticipated award date of 31 August 2007. All responsible sources may submit a proposal, which shall be considered by the agency. Please submit any question to Eva Woloszynski by email at eva.woloszynski@navy.mil or by mail to Commander Code 210000D, NAVAIR WD, 429 East Bowen Rd Stop 4015, China Lake, CA 93555-6108. NAICS Code = 334418 Place of Performance = N/A Set Aside = Small-business Email Address = eva.woloszynski@navy.mil
- Record
- SN01336162-W 20070708/070706221135 (fbodaily.com)
- Source
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