SOLICITATION NOTICE
R -- Microelectronic Circuit Board Services
- Notice Date
- 10/11/2006
- Notice Type
- Solicitation Notice
- NAICS
- 334419
— Other Electronic Component Manufacturing
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- H94003-07-R-0001
- Response Due
- 10/24/2006
- Archive Date
- 11/7/2006
- Small Business Set-Aside
- Total Small Business
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; the Defense Microelectronics Activity (DMEA) intends to award multiple firm fixed price Blanket Purchase Agreements for circuit board manufacturing services. The Solicitation number is H94003-07-R-0001, and the solicitation is issued as a Request for Proposal (RFP). The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-13. Set-aside: 100% small business; associated North American Industry Classification System (NAICS) code is 334419; small business size standard: 500 employees. Small Business Competitiveness Demonstration Program: not applicable. Allocations System (DPAS) rating is DO-S1. FAR 52.212-2, Evaluation ? Commercial Items applies, with the following specific evaluation criteria to be included in paragraph (a) Selection Criteria: (1) Must have Quality Plan in place. (2) Can propose to all or any of the major elements 3.1, 3.2, 3.3, and 3.4. (2a) If proposing to major elements 3.1, 3.2, 3.3, and/or 3.4, vendor must be able to perform all sub-elements. (3) Upon request by the Government, the offeror must allow a site survey of their facility. (4) Please provide three references for Past Performance review. (5) QML certification required (ISO 9000), proof must be provided and sent in with the response. (6) Vendor must provide their standard commercial price list to be included as a BPA attachment. Failure to provide all of the above, the offeror will be considered nonresponsive. Technical and past performance, when combined, are significantly more important than cost or price. STATEMENT OF WORK (SOW) DMEA 06-6G4 Dated 24 July 2006. 1.0 SCOPE: 1.1 TITLE: IC/Hybrid/MCM/PCB Packaging, Fabricating and Test Services Blanket Purchase Agreement (BPA). 1.2 BACKGROUND: The Defense Microelectronics Activity (DMEA) has a requirement to provide microelectronics circuit designs, prototypes, layouts, drawings, and test specifications in support of DOD airborne, ground weapons and communications systems. DMEA has been tasked with supporting the reverse engineering and prototyping of replacements for microelectronic devices. The objective is to provide form, fit, and functional replacements for the redesigned end-of- life/unreliable devices. This responsibility includes the redesign of said microelectronic devices. It also includes the insertion of advanced technologies into weapon systems. Providing this support for the weapons systems that use the late generations of advanced microelectronic devices requires manufacturing services not readily available within DMEA. 1.3 PURPOSE: The purpose of this SOW is to obtain manufacturing services for the packaging and testing of Integrated Circuits (ICs) and Hybrids/MCMs along with the fabrication, assembly and testing of Printed Circuit Boards (PCBs). 2.0 GOVERNMENT FURNISHED EQUIPMENT/INFORMATION (GFE/GFI): The government will provide engineering drawings, assembly drawings, and/or requirements specifications as required. 3.0 REQUIREMENTS: 3.1 IC PACKAGING SERVICES: The contractor shall provide the services as defined by each task order to deliver functional packaged IC devices to DMEA. The range of services shall include: 3.1.1 Package and Lid Acquisition: The contractor shall procure packages and lids based upon the requirements specifications provided by DMEA.3.1.2 Wafer Dicing: The contractor shall cut wafers and inspect die based upon the requirements specifications provided by DMEA. 3.1.3 Die Packaging: The contractor shall assemble (e.g. ? die bond, wire bond, lid seal), mark and inspect packaged parts based upon the requirements specifications provided by DMEA. 3.2 HYBRID/MCM ASSEMBLY SERVICES: The contractor shall provide the services as defined by each task order to deliver functional packaged hybrid/MCM devices to DMEA. The range of services shall include: 3.2.1 Parts and Material Acquisition: The contractor shall procure parts and materials based upon the requirements specifications provided by DMEA.3.2.2 Substrate Fabrication: The contractor shall generate the hybrid substrate layout/fabrication drawings and shall fabricate the substrates based upon the requirements specifications provided by DMEA. 3.2.3 Packaging: The contractor shall assemble, mark and inspect packaged parts based upon the requirements specifications provided by DMEA.3.3 IC, HYBRID/MCM TEST SERVICES: The contractor shall provide the services as defined by each task order to deliver functional packaged IC or Hybrid/MCM devices to DMEA. The range of services shall include:3.3.1 Burn-in: The contractor shall perform burn-in based upon requirements specifications provided by DMEA.3.3.2 Electrical Testing: The contractor shall perform electrical testing based upon test specifications provided by DMEA.3.3.3 Screening (as per MIL-STD-883F, MIL-PRF-38534 or MIL-PRF-38535): The contractor shall screen packaged parts based upon the requirements specifications provided by DMEA.3.3.4 Qualification (as per MIL-STD-883F, MIL-PRF-38534 or MIL-PRF-38535): The contractor shall qualify packaged parts based upon the requirements specifications provided by DMEA.3.4 PRINTED CIRCUIT BOARD ASSEMBLY AND TEST SERVICES: The contractor shall provide the services as defined by each task order to deliver functional PCBs to DMEA. The range of services shall include: 3.4.1 PCB Layout: The contractor shall generate the PCB layout and fabrication drawings based upon the requirements specifications provided by DMEA. 3.4.2 Parts and Material Acquisition: The contractor shall procure parts and materials based upon the requirements specifications provided by DMEA.3.4.3 PCB Fabrication: The contractor shall fabricate PCBs based upon the requirements specifications provided by DMEA.3.4.4 Opens/Shorts Testing: The contractor shall perform opens and shorts testing on the fabricated PCBs.3.4.5 PCB Assembly: The contractor shall assemble and inspect the PCB assemblies based upon the requirements specifications provided by DMEA.3.5 REVIEWS: The contractor shall participate in technical interchange meetings to be held at the contractor's facility as defined by each task order.3.6 DATA: The contractor shall deliver all data necessary to document the work accomplished under this SOW as defined by each task order.The following FAR clauses apply: 52.212-1, Instructions to Offerors-Commercial, Jan 1999; 52.212-3, Offeror Representations and Certifications-Commercial Items, Jan 2006; 52.212-4, Contract Terms and Conditions-Commercial Items, Sep 2005 and 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items, Aug 2006 (additional clauses and provisions to be determined by the Contracting Officer after receipt of offers); FAR 52.203-6, Restrictions on Subcontractor Sales to the Government, with Alternate I, Oct 1995; FAR 52.219-6, Notice of Total Small Business Aside, June 2003; FAR 52.222-21, Prohibition of Segregated Facilities, Feb 1999, FAR 52.222-26, Equal Opportunity, Apr 2002; FAR 52-232.33, Payment by Electronic Funds Transfer ? Central Contractor Registration, Oct 2003; FAR 52,216-18, Ordering, Oct 1995; DFARS 252.212-7001, Contract Terms and Conditions Required to Implement Statues or Executive Orders Applicable to Defense Acquisitions of Commercial Items, Jun 2005 (additional clauses and provisions to be determined by the Contracting Officer after receipt of offers); FAR 52.246-2, Inspection of Supplies Fixed Price, Aug 1996; FAR 52.246-4, Inspection of Services Fixed Price, Aug 1996; DFARS 252.225-7001, Buy American Act and Balance of Payments Program, Jun 2005; DFARS 252.232-7003, Electronic Submission of Payment Requests, May 2006; DFARS 252.247.7023, Transportation of Supplies By Sea, May 2002; DFARS 252.243-7001, Pricing of Contract Modifications, Dec 1991. Invoice Requirements: In accordance with FAR 52.212-4, paragraph (g), the contractor shall submit an electronic invoice to: Defense Microelectronics Activity, Contracting Office, 4234 54th Street, McClellan, CA 95652-2100. As the receiving document, the contractor shall submit, along with the invoice, the SF 1449 with block number 33 completed. Contractors must be registered in the Central Contractor Registration (CCR) database prior to an award. All responsible sources may submit a proposal, which shall be considered by the agency. For a purchase description organized in an outline form, send an email request to verner@dmea.osd.mil or submit a fax request to (916) 231-2835. Your company?s full name and address must be included in your request for our file. The name and telephone number of the individual to contact for information regarding this notice: Contract Specialist Kurt Verner, (916) 231-1525, Contracting Officer Linda A. Baustian, (916) 231-2816. Anticipated award date: 10/30/06. Anticipated Period of Performance: 11/01/06 to 10/31/11 FOB/Inspection/Acceptance at Destination: Defense Microelectronics Activity, 4234 54th Street, McClellan, California 95652-2100.
- Place of Performance
- Address: Defense Microelectronics Activity,, 4234 54th Street, McClellan, CA
- Zip Code: 95652
- Country: UNITED STATES
- Zip Code: 95652
- Record
- SN01164180-W 20061013/061011220829 (fbodaily.com)
- Source
-
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