SOURCES SOUGHT
66 -- Deep Reactive Ion Etching System
- Notice Date
- 3/28/2006
- Notice Type
- Sources Sought
- NAICS
- 339111
— Laboratory Apparatus and Furniture Manufacturing
- Contracting Office
- Department of Energy, Brookhaven National Laboratory (DOE Contractor), Brookhaven, PO Box 5000 Bldg. No. 355, Upton, NY, 11973
- ZIP Code
- 11973
- Solicitation Number
- DRIERFP106055
- Response Due
- 4/9/2006
- Archive Date
- 4/24/2006
- Description
- Brookhaven Science Associates plans to acquire a Deep Reactive Ion Etching (DRIE) tool for the Nanopatterning Laboratory of the Center for Functional Nanomaterials (CFN) at Brookhaven National Laboratory. DRIE is an inductively-coupled plasma etching process that can fabricate micro and nanoscale structures with extremely high aspect ratios from silicon wafers and a few other select materials. DRIE silicon etch processes can be divided into the Bosch process, which controls the sidewall geometry by rapidly cycling between etching and deposition steps, and the Cryo process, which uses a substrate cooled to about ?100oC to promote oxide/fluoride deposition to preserve the sidewalls as well as inhibiting attack of the protective mask. The Bosch process requires high capacity vacuum pumps, mass flow controllers with rapid-response rates, and relatively high etch gas flow rates that increase operating costs. The Cryo process requires a cryogenically cooled stage, control of oxygen at low flow rates, and careful attention to efficient thermal transfer between the wafer and the stage. It is required that DRIE etching equipment for the CFN must have both Cryo and Bosch etching capability. Prospective vendors must supply detailed specifications on how their equipment meets the above requirements for both the Bosch and Cryo process and be prepared to etch test silicon wafers supplied by BNL using both methods. The wafers will be returned to BNL and evaluated by optical and scanning microscopy. Equipment Criteria: Vendors must supply detailed descriptions and dimensioned layout drawings of the deep reactive ion etcher, the materials used in its construction, failure rate data and, where applicable, manufacturer?s specifications of subsystems such as vacuum pumps, mass flow controllers, and RF generators. The vendors proposed system will be evaluated for operational reliability, quality of construction, and cost. Process Criteria: Vendors must provide a details concerning etching chemistry, power level and, material removal rates. BSA will submit its samples to the vendor?s application laboratory and evaluate the results with its own equipment. Proposals are due April 09, 2006, by 4:00 PM, EDT, and shall be submitted to Brookhaven Science Associates, Brookhaven National Laboratory, Attention: D. Paveglio, Bldg. 355, Upton, NY 11973, by US mail This RFP has been sent to the following known manufacturers: Tri-State Technologies Inc., Mountainside , NJ Trion Technologies, Clearwater, FL Oxford Instruments, Concord, MA Surface Technology Systems plc, Newport, UK ALCATEL Vacuum Products, Fremont, CA All other interested vendors may down load Request for Proposal DRIERFP106055 from this website or contact David J. Paveglio.
- Place of Performance
- Address: Brookhaven National Laboratory, Upton, NY
- Zip Code: 11973
- Country: USA
- Zip Code: 11973
- Record
- SN01015937-W 20060330/060328211733 (fbodaily.com)
- Source
-
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