SOURCES SOUGHT
A -- Radiation Hardened Cryogenic Readable Integrated Circuits (ROIC)
- Notice Date
- 5/27/2004
- Notice Type
- Sources Sought
- NAICS
- 334413
— Semiconductor and Related Device Manufacturing
- Contracting Office
- Department of the Air Force, Air Force Materiel Command, AFRL - Wright Research Site, Det 1 AFRL/PK Bldg 167, Area B, 2310 8th Street, Wright-Patterson AFB, OH, 45433-7801
- ZIP Code
- 45433-7801
- Solicitation Number
- Reference-Number-Title-III-MLK
- Response Due
- 7/1/2004
- Archive Date
- 7/16/2004
- Point of Contact
- Susan Palmer, Contracting Officer, Phone (937) 656-9883, Fax (937) 255-5302, - Brad Sampson, Project Engineer, Phone (937) 904-4321, Fax null,
- E-Mail Address
-
Susan.Palmer@wpafb.af.mil, Brad.Sampson@wpafb.af.mil
- Description
- This is a sources sought announcement to identify potential domestic sources and gather information on current capabilities within the domestic market. This notice is neither a solicitation for, nor request for competitive proposals. The Defense Production Act (DPA) (50 U.S.C. App. 2061 et seq.), Title III Program Office, Air Force Research Laboratory, Manufacturing Technology Division (AFRL/MLM) is contemplating a project to establish a domestic supplier(s) of commercial, deep submicron Complimentary Metal Oxide Semiconductor (CMOS) (<0.5mm) ROICs processed for radiation tolerant and radiation hardened applications in order to meet known and evolving military requirements. The Title III Radiation Hardened Cryogenic ROIC project will extend the current knowledge and capability to fabricate advanced ROICs for DOD programs at the foundry level. The Title III program is looking to leverage one or more commercial foundry to make advanced ROICs for the DOD and to incentivize them to achieve the desired geometries (i.e. <0.50 mm) on their commercial production processes for radiation hardened/tolerant cryogenic ROICs. The Title III Radiation Hardened Cryogenic ROIC program will compliment another envisioned project sponsored by the Missile Defense Agency (MDA) that will focus on ROIC architecture development, circuit design, simulation, layout, and verification. Working together with MDA, Title III will be able to impact both the design and fabrication of the desired geometries (i.e. <0.50 mm) on commercial production processes for radiation hardened/tolerant cryogenic ROICs. Interested parties should discuss their capabilities concerning production interface with design kits, cell libraries, and process models associated with the ROIC design (i.e. design house and foundry interface). The DOD needs highly specialized, mixed mode (analog/digital) circuitry that operates in demanding environments. Such sophisticated circuitry includes ROICs for imaging devices that need to operate in various combinations of radiation conditions and cryogenic temperatures. These conditions are typical of airborne and space borne applications. ROICs are found in focal plane arrays (FPA) for imaging, tracking, and detecting in space and other applications. The demands for cryogenic radiation hardened/tolerant ROICs designs are increasing each year. The length of most space missions are increasing therefore increasing the dose of natural radiation the ROIC is exposed to. Interested parties should be familiar with and be able to comply with the recently approved High Altitude Exoatmospheric Nuclear Survivability standard (MDA-STD-001). Interested parties should have documented expertise and existing capability in domestic production of ROICs with cryogenic and radiation hardening/tolerant capabilities. Additionally, the ability to economically produce larger physical size devices (??6.4cm X 6.4cm) is a requirement. Government representatives may wish to discuss interested parties DOD ROIC customer base. Understanding of the current customer base for ROIC (with and without radiation hardening and cryogenic capabilities) is essential in determining business viability and overall project risk factors. The government contemplates that the Title III Radiation Hardened Cryogenic ROIC project will last 24-36 months. Other items that will be discussed include business plans as well as an understanding of DOD ROIC production plans to assist in determining market share and their response to customer demands. Tasks envisioned for the Title III Cryogenic Microelectronics project would include: -- Demonstrate Manufacturing Process Improvements; -- Defect Prevention; -- Yield Improvements; -- Large Device Processing; -- Cycle Time Improvement; -- Special Test Equipment Acquisition; -- Capital Equipment Enhancement; -- Production Interface with Design Kits, Cell Libraries, and Process Models; -- Manufacture ROIC Samples (w/ cryogenic, rad hard (tolerant), and physical size characteristics); -- Characterize Performance of ROIC Samples; -- Defect Density and Distribution; -- Electrical Performance; -- Radiation Tolerant and Radiation Hardening; -- Cryogenic Temperatures; Under the authority of the DPA, any potential acquisition is restricted to sources with domestic production capabilities; therefore, firms without domestic production capabilities are ineligible for any potential award. All submitted information should be limited to no more than 15 pages, one-sided, minimum font size 10 and should be sent to Susan Palmer, Contract Negotiator, at (937) 656-9883 facsimile (937) 255-5302 or via e-mail at susan.palmer@wpafb.af.mil by 01 JUL 2004 no later than 1500 EST. Submittals via email are preferred. A determination by the Government not to compete this proposed requirement based upon responses to this notice is solely within the discretion of the Government. Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement. The NAICS Code for this action is 334413 with a size standard of 500. All routine communications regarding this announcement should be directed to the technical or contractual points of contact listed above. All responsible sources may submit information that shall be considered by the agency. See Numbered Note 25.
- Record
- SN00593652-W 20040529/040527212016 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
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