SOLICITATION NOTICE
66 -- Plasma Metal Etcher
- Notice Date
- 12/18/2003
- Notice Type
- Solicitation Notice
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- H94003-04-R-4001
- Response Due
- 1/14/2004
- Archive Date
- 1/29/2004
- Point of Contact
- Judy Hilton, Contracting Officer, Phone (916) 231-1526, Fax (916) 231-2826,
- E-Mail Address
-
hilton@dmea.osd.mil
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6 as supplemented with additional information included in this notice. This announcement constitutes the solicitation. The NAICS code is 333295 and the size standard for this requirement is 500 employees. Solicitation 4ME4B601 is issued as a Request for Proposal H94003-04-R-4001. Specifications for the Plasma Metal Etcher shall meet or exceed the following minimum requirements: 600 watt RIE, 13.56 MHz RF generator with automatic tuning close coupled to lower electrode; 1250 watt ICP, 13.56 MHz RF generator with automatic tuning; DC bias control and measurement; Computer control of both REI and ICP generators; 200mm water cooled RIE bottom electrode; Computer controlled vacuum load-lock and load-lock carriers capable of transferring SEM pin stubs and 5" to 8" wafers into reactor chamber; 250mil or greater vertical clearance above the SEM stub carrier; Computer controlled robotic carrier transfer, load-lock roughing and isolation gate valve; 400 liter/sec or greater dual magnetic bearing corrosive turbo pump; 50 cfm or greater corrosive dry pump for turbo pump roughing; Computer control and measurement of chamber pressure; System console with on-board programmable logic controller; Microsoft Windows based graphical user interface control software for recipe storage, password security control, and data logging installed on an included IBM compatible pc; Emergency Off and AC distribution; External vented enclosure with gas manifold for eight MFC gas lines; MFC's and valves installed in the enclosure for Cl2, BCl3, CF4, SF6, O2, and Ar with the two unused lines capped; All gas line connections inside the enclosure shall be VCR type fittings; Process gas line supply connections to the enclosure for Cl2 and BCl3 shall facilitate welded double wall stainless steel lines vented into the enclosure; Process gas line delivery connections at the enclosure shall facilitate welded double wall stainless steel line vented into the enclosure; All other process gas line connections shall be VCR type fittings; One complete set of printed operation and maintenance manuals and a copy on CD-ROM; On-site unpacking and installation preparation of plasma metal etcher and consultation with DMEA installers; On-site post installation startup and verification of operation; 12 month warranty (includes parts and labor); 2 years additional service contract. Delivery is 1 Jun 2004. FOB is destination.Contractors must be registered in the Central Contractor Registration (CCR) prior to an award. The following FAR clauses apply: 52.212-1, Instructions to Offerors ?Commercial; 52.212-3, Offeror Representations and Certifications-Commercial Items (which is required to be submitted with the proposal); 52.212-4, Contract Terms and Conditions-Commercial Items and 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items. DPAS rating is C9E. Questions regarding this solicitation should be addressed to Hilton@dmea.osd.mil. Offerors are due at 3:00PM on 14 Jan 2004.
- Place of Performance
- Address: Defense Microelectronics Activity, 4234 54th Street, McClellan, CA 95652-2100
- Record
- SN00492459-W 20031220/031218212746 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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