SOLICITATION NOTICE
70 -- Evolved Sea Sparrow Missile prototype and pre-production Board Layout, Fabrication, and Assembly
- Notice Date
- 8/1/2003
- Notice Type
- Solicitation Notice
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- Reference-Number-3RC3D901
- Response Due
- 8/15/2003
- Archive Date
- 8/30/2003
- Point of Contact
- Kurt Verner, Contracts Specialist, Phone (916)231-1525, Fax (916)231-2835, - Kathy Anderson, Contracting Officer, Phone (916) 231-1524, Fax (916) 231-2836,
- E-Mail Address
-
verner@dmea.osd.mil, andersonka@dmea.osd.mil
- Description
- The Defense Microelectronics Activity (DMEA) has a requirement for the Evolved Sea Sparrow Missile (ESSM) prototype and pre-production circuit board layout, fabrication, and assembly. Circuit board design layout ? two (2) each prototype circuit boards and seven (7) each pre-production circuit boards. Circuit board fabrication and testing- two (2) each prototype circuit boards for each of the three (3) circuit card designs and four (4) each pre-production circuit boards for each of the seven (7) circuit card designs. Circuit board assembly ? two (2) each prototype circuit boards for each of the three (3) circuit card designs and four (4) each pre-production circuit boards for each of the seven (7) circuit card designs. The following drawing numbers will apply: Circuit board design layout ? two (2) each prototype circuit boards (DMEA 01100169: 2A3, Digital to Analog Converter Card and DMEA 01100172: 2A12, Input Signal Processor Card.) and seven (7) each pre-production circuit boards (DMEA 02100168: 2A1, Analog Data Acquisition Card, DMEA 01100168: 2A2, Subsystems Interface Card, DMEA 01100169: 2A3, Digital to Analog Converter Card, DMEA 01100170: 2A8, CPU - Memory Data Card, DMEA 03060173: 2A10, Processor, Digital Signal Card, DMEA 01100171: 2A11, CPU - Interface Logic Card, & DMEA 01100172: 2A12, Input Signal Processor Card). Circuit board fabrication/testing and assembly ? two (2) each circuit cards for three (3) each prototype circuit boards (DMEA 02100168: 2A1, Analog Data Acquisition Card, DMEA 01100169: 2A3, Digital to Analog Converter Card, and DMEA 01100172: 2A12, Input Signal Processor Card.) and four (4) each circuit cards for seven (7) each pre-production circuit boards (DMEA 02100168: 2A1, Analog Data Acquisition Card, DMEA 01100168: 2A2, Subsystems Interface Card, DMEA 01100169: 2A3, Digital to Analog Converter Card, DMEA 01100170: 2A8, CPU - Memory Data Card, DMEA 03060173: 2A10, Processor, Digital Signal Card, DMEA 01100171: 2A11, CPU - Interface Logic Card, & DMEA 01100172: 2A12, Input Signal Processor Card). Artwork Generation - the contractor shall generate artwork required to fabricate printed circuit boards using the layout(s) generated/performed under the circuit card designs. This shall include, as a minimum: Fabrication and Assembly Drawings, Gerber and Drill files. Documentation - the contractor shall deliver a fabrication and assembly data package. The documentation package shall include, but is not limited to, (1) parts list, with the schematic reference designators, quantity per assembly, part number, contractor format acceptable (2) assembly layout showing the location of each part and any other particulars peculiar to this assembly, contractor format acceptable, (3) Schematic, contractor format acceptable (4) Substrate layout, (Gerber file). The contractor shall deliver the above-mentioned documentation in computer readable (CD-ROM) format. Open/Shorts Testing - the contractor shall develop and perform Open/Shorts Testing on each of the circuit cards fabricated. The contractor shall document the results of each test and contractor format is acceptable. The contractor shall deliver the above-mentioned documentation in computer readable (CD-ROM) format. Board Assembly - the contractor shall assemble two (2) of each type of Prototype Circuit Board and four (4) of each type of Pre-production Circuit Board fabricated and tested. The contractor shall assemble the boards in accordance with the drawing numbers. The Government will furnish the following: One each of Drawing numbers referenced in computer readable (CD-ROM) format; individual circuit board measurement and general parts placement data. Any special instructions and/or specific parts placement consideration information. Data available at contract award. For fabrication and assembly: Updated drawing package ? to include fabrication and assembly data, in computer readable (CD-ROM) format. Data will be made available upon approval of delivered fabrication and assembly data. For assembly: Parts for assembly will be made available upon successful completion of circuit card fabrication and open/shorts testing. Delivery date for circuit board layout is 15 September 2003. Delivery date for circuit board fabrication is 15 October 2003. Delivery date for circuit board assembly is 15 November 2003. FOB/Inspection/Acceptance at Destination: Defense Microelectronics Activity, 4234 54th Street, McClellan, California 95652-2100. The Government intends to award all items on a sole source basis under existing Blanket Purchase Agreement (BPA) DMEA90-01-A-0002 with DVK Integrated Services Incorporated, San Jose, CA 95112-4219. Anticipated award date is 15 August 2003. Solicitation number is 3RC3D901, and the solicitation is issued as a Request for Quotation (RFQ). Interested sources should e-mail detailed documentation of their capabilities, qualifications, past performance, and understanding of the ESSM circuit board layout, fabrication, and assembly process to verner@dmea.osd.mil for consideration. All responsible sources may submit a quotation, which shall be considered by the agency.
- Place of Performance
- Address: Contractor's Facility
- Record
- SN00390300-W 20030803/030801214122 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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