SOLICITATION NOTICE
66 -- Ultra-Fine Pitch Wedge Bonder
- Notice Date
- 3/5/2002
- Notice Type
- Solicitation Notice
- Contracting Office
- Other Defense Agencies, Office of the Secretary of Defense, Defense Microelectronics Activity, Contracting Division 4234 54th Street, Building 620, McCellan, CA, 95652-1521
- ZIP Code
- 95652-1521
- Solicitation Number
- DMEA90-02-R-0003
- Response Due
- 4/4/2002
- Archive Date
- 4/19/2002
- Point of Contact
- Judy Hilton, Contracting Officer, Phone (916) 231-1526, Fax (916) 231-2826,
- E-Mail Address
-
hilton@dmea.osd.mil
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. The NAICS code is 334516 and the SIC is 3826. This RFP is issued unrestricted. Specifications for the Ultra-Fine Wedge Bonder which shall meet the following minimum requirements: Ultra-Fine Pitch Wedge Bonder Specification 5 December 2001 1.0 OBJECTIVE The objective of the Ultra-Fine Pitch Wedge Bonder SOW is to define the requirements for replacing the DMEA K&S 1470 Automatic Wedge Bonder located in Bldg 620, Room 124 of Passivation, Assembly and Substrate Laboratory (PAS Lab). This replacement will provide DMEA with the ability to bond the ever-decreasing size, pitch and complexity of die and hybrid products for the manufacture of semiconductor devices in support of the DMEA mission and advanced microelectronics technology applications programs. 2.0 REFERENCE 2.1 Government Furnished Equipment (GFE) / Government Furnished Services (GFS). DMEA will provide the following materials, equipment and services. a) All required material delivery lines: power, water, nitrogen and Clean Dry Air (CDA). 3.0 REQUIREMENTS 3.1 General Requirements The contractor shall install and demonstrate the technical requirements of the Wedge Bonder as identified in this Statement of Work. The contractor shall provide a recommended product to meet the technical requirements as identified in this Statement of Work. The contractor shall provide detailed instruction on the operation of the Wedge Bonder. 3.2 Technical Requirements: 3.2.1 Wedge Bonder general capabilities: The Wedge Bonder Platform shall be a programmable system for attaching gold and aluminum wire interconnects to semiconductor devices. Major elements of the system shall be: A 360 degree Rotary High Frequency Bondhead, X-Y Table, Material Handling System, Pattern Recognition System, Computer Control System, Optics, and Wire Bond Monitoring System. 3.2.2 Wedge Bonder detailed features and capabilities: The Wedge Bonder shall have the features identified in Appendix A 3.2.3 Wedge Bonder material capabilities: The Wedge Bonder shall have the material capabilities as identified in Appendix B. 3.2.4 Wedge Bonder installation: The contractor shall verify that all Wedge Bonder features, additional capabilities, and materials as described are received by DMEA at the time of installation. The contractor shall install Wedge Bonder in PAS Lab room 124 of building 620. The contractor shall identify and provide any connections required outside what is described in the government furnished material delivery lines. Upon completion of the installation the contractor shall demonstrate the Wedge Bonder features. This is to include DEMA provided products for bonding demonstration. 3.2.5 Operation/Maintenance Familiarization: The contractor shall provide on-site Operation / Maintenance familiarization for up to six (6) DMEA personnel for two eight-hour days. The contractor shall provide 2 familiarization manuals (including, but not limited to: OEM equipment manuals for Wedge Bonder and operator workbooks). The contractor shall identify to DMEA, not less than two (2) weeks prior to scheduled operation/maintenance familiarization. 3.2.6 Warranty: The contractor shall provide a one (1) year warranty for the Wedge Bonder. This warranty shall cover all parts and labor required to service the Wedge Bonder during routine preventative inspections or emergency repairs. The contractor shall provide approved technical field support to perform corrective actions on reported failures within 48 hours after notification by approved DMEA personnel. Approve DMEA personnel authorized to call for service includes: William Beard DMEA/METP Primary (916) 231-1651 Dean Taylor DMEA/METP Alternate 1 (916) 231-1629 Cary Meline DMEA/METP Alternate 2 (916) 231-1596 Appendix A Wedge Bonder Salient Features and Capabilities Bond pad pitch capability ? 55 um @ +/- 3 sigma in Gold (AU) wire and 60 um @ +/- 3 sigma in Aluminum (AL) wire At a minimum, bond placement specification ? accuracy 2.60 um, theta resolution 0.04 degrees, rotation 360 degrees Number of wires storage at least 2000 Fully programmable automatic boat material handling system Linear X-Y Table with direct drive voice coil motors At a minimum, 0.1 um resolution XY table with 63 x 63 mm bondable area Light Emitting Diode (LED) Illumination System with 256 level vertical, oblique, and high angle oblique arrays Ergonomically designed work station Process monitoring/ control, device status, machine status, wire status Real-time process checks, missing wire detection, device overheat, device under heat, wire feed failure, utilities interruption Machine performance logging ? wedge usage, number of devices, throughput, errors, maintenance history, programmable alarm reporting and indicting system At minimum a Stereo zoom microscope 12-49x magnification Electronic digital zoom, high resolution Charged Coupled Device (CCD) camera, vertical, oblique and high angle obliqued LED Illumination At minimum a High frequency 120 kHz ultrasonic generator with Phase Lock Loop (PLL) 360 degree rotary bondhead with standard 45 degree clamp set-up and 120 kHz transducer with option to purchase 30 and 60 degree product later Wire feed system with contact less wire sensor and end-of-spool detection Battery back-up Ram Ethernet Interface Instruction and Maintenance Manuals (2 copies) Bondhead Set-up Kit at a minimum to include the required tools to enable the set-up of equipment and any unique tools required for maintenance. Wedge Installation Kit to include set-up gauge assembly and bi-directional torque wrench and power bit. Heat kit with pre/post heat capability ? temperature control of three zones ? independently programmable ? preheat, bond site, post heat Material handling system set-up tool kit Contractor must provide a timeline for installation two weeks after award This is a turn key requirement. Appendix B Wedge Bonder Material Capabilities Package types to be supported at a minimum be shall be CPGA, PPGA, CLCC, COB, MCMs, RF, SIMM, COF, COG, SOS, Cerdip, BGAs, SIP, CQFP, Ceramic substrates, Leadframes, Strip COB, PCB. Package dimensions of bondable area at minimum 63 x 63 mm, package size 86 x 86 mm, in manual workhold 120 in Y and 150 in X mm. The wire spool system shall detect the end of wire on the wire spool, stop bonder and notify user. Wire diameter for gold 18-50 um, and aluminum 26-50 um. Stitch bonding capable for 9 bonds, 8 loops. Temperature control of 3 zones with programmable temperature target settings. Wire bonding specification shall have placement accuracy of 2.5 um or better, repeatability of 1.7 um @ 1 sigma, .04 degree rotation resolution with total of 360 degree rotation, pitch or 55 um @ 3 sigma in gold and 60 um in Aluminum There shall be process monitoring and control with pre-bond process checks, real-time process checks, machine performance logging. Pre-bond process checks are prior to bonding, the bonder will check device status, machine status, and wire status. If they are unacceptable, the bonding process will not begin. Real-time process checks after the pre-bond check, events are monitored in real-time and an error message will be displayed when any events occur. Machine performance logging will include such things as process data, track, calculate, and display relevant machine performance statistics and store in appropriate counters. The emergency off safety control shall be positioned and readily accessible from the front of the machine, audible alarm. Security lockout-password enabled system. User interface shall be a ?windows? type Graphical User Interface to include menu panel, and programmable alarm reporting and indicators. Operations and Maintenance Manuals are to include and illustrated part book of all parts, electrical documents, material handing system, operations, maintenance, and an operator handbook (2 copies). For an experienced operator or technician conversion times, wire spool change time, wedge change time shall not be more the 30 minutes. Quantity of 1 each for FOB destination to McClellan, CA 95652-2100. The following FAR clauses apply: 52.212-1, Instructions to Offerors ?Commercial; 52.212-3, Offeror Representations and Certifications-Commercial Items; 52.212-4, Contract Terms and Conditions-Commercial Items and 52.212-5, Contract Terms and Conditions Required to Implement Statutes or executive Orders-Commercial Items. Offerors must include a completed copy of the provision 52.212-3, Offeror Representations and Verifications-Commercial Items. DPAS rating of C9. Delivery is requested for 90 days ARO. Offerors are due at 3:00PM on 4 April 2002. Contractors must be registered in the Central Contractor Registration (CCR) prior to an award. Questions regarding this solicitation should be addressed to J. Hilton at (916) 231-1526 or Hilton@dmea.osd.mil. Note: If your company wants to submit a proposal on this requirement, suggest you call for a hard copy of the SOW and Appendices. This FedBizOpps program sometimes substitutes symbols in the requirement and replaces them with question marks.
- Place of Performance
- Address: 4234 54th Street, McClellan, CA 95652-2100
- Record
- SN00035994-W 20020307/020305213358 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
(may not be valid after Archive Date)
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