PRESOLICITATION NOTICE
59 -- ELECTRICAL AND ELECTRONIC EQUIPMENT COMPONENTS
- Notice Date
- 1/8/2002
- Notice Type
- Presolicitation Notice
- Contracting Office
- Department of the Navy, Office of Naval Research, Naval Research Laboratory, 4555 Overlook Ave. S.W., Washington, DC, 20375
- ZIP Code
- 20375
- Solicitation Number
- N00173-02-R-KK01
- Response Due
- 1/30/2002
- Archive Date
- 2/14/2002
- Point of Contact
- Kevin King, Contract Specialist, Phone 202-767-1495, Fax 202-767-5896, - Wayne Carrington, Contracting Officer, Phone 202-767-0393, Fax 202-767-5896,
- E-Mail Address
-
king@contracts.nrl.navy.mil, carrington@contracts.nrl.navy.mil
- Description
- This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Federal Acquisition Regulations (FAR) Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued. The solicitation, N00173-02-R-KK01 is issued as a Request for Proposal (RFP). The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 01-03, and DFARS and NAPS as of 12/21/2001. The associated NAICS code is 334413. and the small business size standard is 500 employees. NRL has a requirement for a Precision Alignment Tool. This tool is required for advanced photolithography and aligned wafer bonding of semiconductor substrates. This tool will be used to support activities in the development of advanced high power electronic devices. The development of these devices is critical to future naval capabilities. This tool must meet or exceed the following minimum specifications: 1) The precision alignment tool (or system) must be capable of precise wafer to mask alignment for photolithographic exposure. The alignment tool must be, with appropriate upgrades, capable of aligning two wafers for wafer bonding. 2) The tool must be capable of handling up to 150 mm semiconductor wafers with a wafer thickness range of 0.1-10 mm. 3) Photolithographic exposure modes must include: Hard, soft, vacuum contact, and proximity. 4) The tool must be capable of semi-automatic wafer loading and must be fitted with mechanical prealignment of wafers. 5) The tool must have a manual alignment system with alignment accuracy of 0.5 micrometers including X,Y, and Theta micrometer controls, and an automatic wedge compensator with an air bearing precision stage. The contact force must range from at least 0.5-40 N and be adjustable. There must be no shift between the mask and the wafer. A mask holder for 5" mask plates and a wafer chuck for 4" wafers must be provided. 6) The microscope for alignment must consist of a motorized splitfield microscope with high resolution CCD-cameras. The microscope travel range must be at least 30-150 mm in the x-direction and -70/+70 mm in the y-direction. Computer storage of objective positions for bond alignment is required. The microscope objectives must have a magnification of at least 10X. 7) The exposure optics system must include a 500 watt Hg lamp and power supply; a dielectric mirror (for 350-450 nanometer wavelengths); 6" field lens; Fly eye lens; and a fast response shutter (at least a 40 millisecond response time). The optical system must provide an intensity uniformity of +/- 4% over a 6" wafer. 8) The tool must include a personal computer (PC) and software for processes, diagnostics, and operation, and the capability to upgrade the computer system to provide additional bonding capabilities such as backside to frontside alignment. The PC must be Pentium based and have an MS-Windows based operating system. 9) A rack for this tool must be provided including a vibration isolation table. This rack must be capable of being upgraded with a robotic autoload system. 10) This alignment tool must be compatible with NRL's existing Electronic Vision Group model 501 bond tool (specifically the bond chucks) for wafer bonding (direct, anodic, high vacuum (1x10-6 mbar), high temperature (550?C) and themocompression bonding). 11) This tool must have the capability to mount an integrated backside microscope. 12) The contractor shall install this tool at NRL, Washington, D.C. NRL will provide the utilities at the installation site. Installation of this system will include acceptance testing to an acceptance test plan. The test plan will be submitted by the contractor and approved by NRL prior to the commencement of installation. 13) After installation at least 24 hours of on-site operator and maintenance training will be provided for a maximum of two people. 14) DOCUMENTATION: The Contractor shall provide two copies of a manual that covers installation, maintenance, and system operation. 15)WARRANTY - All equipment shall be warranted in accordance with standard commercial practices. The warranty period shall begin after acceptance of the system. Delivery and acceptance is at NRL, 4555 Overlook Ave. SW, Washington, D.C. 20375, FOB Destination. Delivery shall be no later than 180 days from date of award. The provision at 52.212-1, Instructions to Offerors--Commercial, applies to this acquisition. The Government intends to award a contract resulting from this solicitation to that responsible offeror proposing the lowest price for the items that have been determined to comply with the requirements of the specifications and solicitation. The proposal must demonstrate an understanding of the requirement and the ability to meet the specifications. General statements that the offeror can or will comply with the requirements, that standard procedures will be used, that well-known techniques will be used, or paraphrases the RFP specifications in whole or in part will not constitute compliance with this requirement concerning the content of the technical proposal. Offerors must complete the following documents: FAR 52.212-3 Offeror Representations and Certifications--Commercial Items and DFARS 252.212-7000, Offeror Representations and Certifications--Commercial Items. These documents are available electronically at : http://heron.nrl.navy.mil/contracts/reps&certs.htm The clauses at FAR 52.212-4, Contract Terms and Conditions-Commercial Items and FAR 52.212-5, Contract Terms and Conditions Required To Implement Statutes or Executive Orders--Commercial Items, apply to this acquisition. The following FAR clauses cited in the clause are applicable to this acquisition: FAR 52.203-6, FAR 52.219-4, FAR 52.219-8, FAR 52.222-21, FAR 52.222-26, FAR 52.222-35, FAR 52.222-36, FAR 52.222-37, FAR 52.225-13, FAR 52.225-15, FAR 52.232-33, FAR 52.232-36, FAR 52.247-64. The DFARs clauses at 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Executive Orders Applicable to Defense Acquisitions of Commercial Items are applicable. The additional DFARs clauses cited in the clause are applicable: DFARS 252.225-7001, DFARS 252.225-7012, DFARS 252.225-7036,DFARS 252.227-7015, DFARS 252.227-7037, DFARS 252.243-7002, DFARS 252.247-7023. The following additional FAR clauses apply: 52.203-8; 52.203-10. The following additional DFARs clauses apply: 252.204-7004. All EIT supplies and services provided under must comply with the applicable accessibility standards issued by the Architectural and Transportation Barriers Compliance Board at 36 CFR part 1194 (see FAR Subpart 39.2). Electronic and information technology (EIT) is defined at FAR 2.101. Any resultant contract will be a DO Rated order under the Defense Priorities and Allocations System (DPAS).The Contract Specialist must receive any questions no later than 10 calendar days before the closing date of the proposal. An original and two (2) copies of the offeror's proposal shall be delivered to Contracting Officer, Bldg. 222, Room 115, Naval Research Laboratory, 4555 Overlook Ave. SW Washington, D.C. 20375-5326 on or before 4:00PM, local time, January 30,2002. The package should be marked with the solicitation number and due date and time.
- Record
- SN20020110/00012623-020109090618 (fbodaily.com)
- Source
-
FedBizOpps.gov Link to This Notice
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